E6420BBG Semtech, E6420BBG Datasheet - Page 18

• Manufacturer Part Number: E6420BBG
• Manufacturer: Semtech

Specifications of E6420BBG

• Lead Free Status / RoHS Status: Not Compliant

HIGH-PERFORMANCE PRODUCTS – ATE
Package Information (continued)
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Substrate material base is BT resin.
11. The overall package thickness “A” already considers collapse balls.
12. Dimensioning and tolerancing per ASME Y14.5M 1994.
2000 Semtech Corp.
All dimensions are in millimeters.
‘e’ represents the basic solder ball grid pitch.
“M” represents the basic solder ball matrix size, and symbol “N” is the number
of balls after depopulating.
‘b’ is measurable at the maximum solder ball dimaeter after reflow parallel
to primary datum –C–.
Dimension ‘aaa’ is measured parallel to primary datum –C–.
Primary datum –C– and seating plane are defined by the spherical crowns of the
solder balls.
Package surface shall be matte finish charmilles 24 to 27.
Package centering to substrate shall be 0.0780 mm maximum for both X and Y
directions respectively.
Package warp shall be 0.050 mm maximum.
E2
NOTE: The inner 9x9 balls are for improved thermal dissipation.
They will be at the VEE potential, so board layout should ensure
that these inner balls are connected to the VEE plane.
SIDE VIEW
TOP VIEW
DETAIL A
D2
D
A2
c
aaa C
A1
Edge6420BBG Package
–A–
A
0.10
Detail A
E
5
// bbb C
// ccc C
–C–
SEATING
PLANE
–B–
6
18
DETAIL B
(E1)
15 14 13 12 11 10 9
f
f
BOTTOM VIEW
e
(D1)
8
4
NX
7
6
0.15 M C A M B M
0.075 M C
5
b
Detail B
4
3
2
1
G
M
A
B
C
D
E
F
H
J
K
L
N
P
R
R
a
b
I D
c
A
A
D
D
E
E
M
N
E
A
E
b
c
a a
b
c c
e
f
1
2
1
2
1
2
M
b
F
E
N
S
1
1
1
Edge6420
0
0
0
0
0
O I
M
2
2
2
9 .
2 .
5 .
4 .
8 .
9 .
9 .
9 .
N I
N
6
1
0
0
0
A
0
0
0
L
1
1
www .semtech.com
R
1
1
1
1
1
N
E
1
0
0
2 .
2 .
0
0
0
3
3
3
2
0
F
O
0 .
2 .
5 .
4 .
2 .
9 .
1
0
0 .
0 .
0
0 .
2
8 .
E
5
M
6
6
5
5
5
0
5
R
B
0
0
B
0
E
S
S
C
C
N
C
1
1
1
1
0
0
0
0
0
0
1
M
E
3
3
3
1 .
3 .
6 .
5 .
1 .
2 .
2 .
0 .
A
1 .
1 .
1 .
S
X
6
1
0
5
2
0
0
0
0
0
0