HI-8585PSI Holt Integrated Circuits, HI-8585PSI Datasheet - Page 5

• Manufacturer Part Number: HI-8585PSI
• Manufacturer: Holt Integrated Circuits

Specifications of HI-8585PSI

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Rad Hardened: No
• Lead Free Status / RoHS Status: Not Compliant

HEAT SINK - ESOIC PACKAGES
An 8-pin thermally enhanced SOIC package is used for the
HI-8585/HI-8586 products. The ESOIC package includes
a metal heat sink located on the bottom surface of the
device. This heat sink should be soldered down to the
printed circuit board for optimum thermal dissipation. The
PACKAGE THERMAL CHARACTERISTICS
Notes:
10. Current values are per supply.
8 Lead Plastic ESOIC
8 Lead Plastic ESOIC
8 Lead Plastic ESOIC
8 Lead Plastic ESOIC
1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB.
6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB.
7. Similar results would be obtained with TXAOUT shorted to TXBOUT.
8. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
9. Data will vary depending on air flow and the method of heat sinking employed.
PACKAGE STYLE
PACKAGE STYLE
8 Lead Plastic DIP
8 Lead Plastic DIP
as this is considered unrealistic for high speed operation.
1
1
6
6
5
5
TXAOUT and TXBOUT Shorted to Ground
High Speed
High Speed
DATA RATE
DATA RATE
Low Speed
Low Speed
ARINC 429
High Speed
High Speed
ARINC 429
High Speed
High Speed
Low Speed
Low Speed
Low Speed
Low Speed
MAXIMUM ARINC LOAD
HOLT INTEGRATED CIRCUITS
3
3
4
4
HI-8585, HI-8586
Ta = 25
Ta = 25
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
16.8
27.3
17.4
27.6
17.1
27.3
53.6
46.9
46.4
42.1
48.5
46.8
o
o
C
C
5
Ta = 85
Ta = 85
heat sink is electrically isolated from the chip and can be
soldered to any ground or power plane. However, since
the chip’s substrate is at V+, connecting the heat sink to
this power plane is recommended to avoid coupling noise
into the circuit.
17.2
26.7
17.5
27.1
17.2
27.1
50.7
38.7
47.6
43.8
45.6
41.1
o
o
C
C
Ta=125
Ta=125
9, 10
16.9
25.9
16.9
25.9
16.7
26.2
52.2
42.5
68.1
67.1
46.1
40.5
2
2
o
o
C
C
7, 8, 9, 10
Ta = 25
Ta = 25
JUNCTION TEMP, Tj (°C)
JUNCTION TEMP, Tj (°C)
131
135
167
177
112
116
58
75
68
97
52
57
o
o
C
C
Ta = 85
Ta = 85
116
132
126
147
110
112
181
181
191
212
161
168
o
o
C
C
Ta=125
Ta=125
157
169
166
186
151
157
217
219
221
223
186
197
o
o
C
C