USB3300-EZK Standard Microsystems (SMSC), USB3300-EZK Datasheet - Page 9
USB3300-EZK
Manufacturer Part Number
USB3300-EZK
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet
1.USB3300-EZK.pdf
(14 pages)
Specifications of USB3300-EZK
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
QFN
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
USB3300-EZK
Manufacturer:
SMSC
Quantity:
20 000
Company:
Part Number:
USB3300-EZK-TR
Manufacturer:
MICRON
Quantity:
3 140
Part Number:
USB3300-EZK-TR
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface
SMSC USB3300
PIN
31
32
GND FLAG
REG_EN
RBIAS
NAME
Table 1 USB3300 Pin Definitions (continued)
DIRECTION,
Pull-low
Analog,
CMOS,
Ground
CMOS
TYPE
I/O,
PRODUCT PREVIEW
ACTIVE
LEVEL
N/A
N/A
N/A
9
DESCRIPTION
On-Chip 1.8V regulator enable. Connect to ground to
disable both of the on chip (VDDA1.8 and VDD1.8)
regulators. When regulators are disabled:
External 12KΩ +/- 1% bias resistor to ground.
Ground. The flag must be connected to the ground
plane with a via array under the exposed flag. This
is the main ground for the IC.
External 1.8V must be supplied to VDDA1.8 and
VDD1.8 pins. When the regulators are disabled,
VDDA1.8 may be connected to VDD1.8 and a
bypass capacitor (0.1uF recommended) should be
connected to each pin.
The voltage at VDD3.3 must be at least 2.64V (0.8
* 3.3V) before voltage is applied to VDDA1.8 and
VDD1.8.
Revision 1.08 (11-07-07)