USB3300-EZK Standard Microsystems (SMSC), USB3300-EZK Datasheet - Page 14

• Manufacturer Part Number: USB3300-EZK
• Manufacturer: Standard Microsystems (SMSC)

Specifications of USB3300-EZK

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: QFN
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

Package Outline
Revision 1.08 (11-07-07)
ccc
D2
A1
A2
A3
E1
E2
D1
A
D
E
L
e
b
Figure 9 USB3300-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)
The USB3300 is offered in a compact 32 lead-free QFN package.
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material
conditions (MMC).
0.70
4.85
4.55
3.15
4.85
4.55
3.15
0.30
0.18
MIN
0
~
~
Table 2 32 Terminal QFN Package Parameters
NOMINAL
0.20 REF
0.50 BSC
0.02
0.25
5.0
3.3
5.0
3.3
~
~
~
~
~
~
PRODUCT PREVIEW
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface
MAX
1.00
0.05
0.90
5.15
4.95
3.45
5.15
4.95
3.45
0.50
0.30
0.08
14
Copper Lead-frame Substrate
Overall Package Height
X exposed Pad Size
Y exposed Pad Size
X Mold Cap Size
Y Mold Cap Size
Terminal Length
Mold Thickness
Terminal Width
X Overall Size
Y Overall Size
Terminal Pitch
REMARKS
Coplanarity
Standoff
SMSC USB3300