USB2504A-JT Standard Microsystems (SMSC), USB2504A-JT Datasheet - Page 46

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USB2504A-JT

Manufacturer Part Number
USB2504A-JT
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of USB2504A-JT

Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Operating Temperature (max)
70C
Package Type
TQFP
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant

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Chapter 10 Package Outline
Revision 2.3 (08-27-07)
ccc
A1
A2
E1
R1
R2
L1
D1
W
D
H
A
E
L
e
q
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 10.1 64 Pin TQFP Package Outline (10x10x1.4 mm body - 2 mm footprint)
11.80
11.80
0.05
1.35
9.80
9.80
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm per side.
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
Table 10.1 64 Pin TQFP Package Parameters
12.20
10.20
12.20
10.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
46
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Integrated USB 2.0 Compatible 4-Port Hub
Lead Foot Radius
Lead Foot Length
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
SMSC USB2504/USB2504A
Datasheet

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