UJA1061TW/3V3/C/T/ NXP Semiconductors, UJA1061TW/3V3/C/T/ Datasheet - Page 72
UJA1061TW/3V3/C/T/
Manufacturer Part Number
UJA1061TW/3V3/C/T/
Description
UJA1061TW/HTSSOP32/REEL13DP//3
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1061TW3V3CT.pdf
(77 pages)
Specifications of UJA1061TW/3V3/C/T/
Applications
Automotive Networking
Interface
CAN, LIN
Voltage - Supply
5.5 V ~ 27 V
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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NXP Semiconductors
UJA1061_6
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 29. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 9 March 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Fault-tolerant CAN/LIN fail-safe system basis chip
temperature
peak
UJA1061
© NXP B.V. 2010. All rights reserved.
001aac844
time
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