UJA1061TW/3V3/C/T/ NXP Semiconductors, UJA1061TW/3V3/C/T/ Datasheet - Page 46
UJA1061TW/3V3/C/T/
Manufacturer Part Number
UJA1061TW/3V3/C/T/
Description
UJA1061TW/HTSSOP32/REEL13DP//3
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1061TW3V3CT.pdf
(77 pages)
Specifications of UJA1061TW/3V3/C/T/
Applications
Automotive Networking
Interface
CAN, LIN
Voltage - Supply
5.5 V ~ 27 V
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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NXP Semiconductors
8. Thermal characteristics
UJA1061_6
Product data sheet
Fig 15. Thermal model of the HTSSOP32 package
V1 dissipation
All information provided in this document is subject to legal disclaimers.
6 K/W
Rev. 06 — 9 March 2010
V2 dissipation
20 K/W
Fault-tolerant CAN/LIN fail-safe system basis chip
6 K/W
R th(c-a)
V3 dissipation
23 K/W
T
T
case
amb
(heat sink)
other dissipation
UJA1061
001aac327
© NXP B.V. 2010. All rights reserved.
6 K/W
T
vj
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