PIC24HJ16GP304-H/ML Microchip Technology, PIC24HJ16GP304-H/ML Datasheet - Page 264
![16-bit MCU, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm TUBE](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC24HJ16GP304-H/ML
Manufacturer Part Number
PIC24HJ16GP304-H/ML
Description
16-bit MCU, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP202-ISO.pdf
(272 pages)
3.PIC24HJ32GP202-ISO.pdf
(8 pages)
4.PIC24HJ32GP202-ISO.pdf
(12 pages)
Specifications of PIC24HJ16GP304-H/ML
Core Processor
PIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
16KB (5.5K x 24)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ16GP304-H/ML
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP202-ISO PDF datasheet #2
- PIC24HJ32GP202-ISO PDF datasheet #3
- PIC24HJ32GP202-ISO PDF datasheet #4
- Current page: 264 of 272
- Download datasheet (4Mb)
PIC24HJ32GP202/204 AND PIC24HJ16GP304
TABLE A-2:
DS70289G-page 264
Section 22.0 “Electrical Characteristics”
Section 23.0 “High Temperature Electrical
Characteristics”
Section 24.0 “Packaging Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added 28-pin SSOP Thermal Packaging Characteristics (see
Table
Removed Note 4 from the DC Temperature and Voltage
Specifications (see
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see
Updated Note 3 in the PLL Clock Timing Specifications (see
Table
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see
Updated all SPI specifications (see
and
Added Note 4 to the 12-bit ADC Module Specifications (see
Table
Added Note 4 to the 10-bit ADC Module Specifications (see
Table
Updated all ambient temperature end range values to +150ºC
throughout the chapter.
Updated the storage temperature end range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table
Added the 28-Lead SSOP package information (see
“Package Marking Information”
Details”).
Added the “SS” definition for the SSOP package.
Figure 22-10
Table
22-3).
22-17).
22-39).
22-40).
23-10).
23-17).
23-18).
22-18).
through
Table
Table
Update Description
22-4).
22-9).
Figure
Table
22-20).
22-16).
and
Table 22-28
© 2011 Microchip Technology Inc.
Section 24.2 “Package
through
Section 24.1
Table 22-35
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