PIC16LF1827-E/ML Microchip Technology, PIC16LF1827-E/ML Datasheet - Page 357
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16LF1827-E/ML
Manufacturer Part Number
PIC16LF1827-E/ML
Description
18 Pin, 7 KB Flash, 384 Bytes RAM, 32 MHz Int. Osc, 16 I/0, Enhanced Mid Range C
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Specifications of PIC16LF1827-E/ML
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Processor Series
PIC16LF
Core
PIC
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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29.6
2010 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
JMAX
= Ambient Temperature
= Junction Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JC
I
JA
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
+125°C
Preliminary
Typ.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
150
—
—
—
—
PIC16F/LF1826/27
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
18-pin PDIP package
18-pin SOIC package
20-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
18-pin SPDIP package
18-pin SOIC package
20-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
DS41391C-page 357
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))
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