PIC16F616-H/ST Microchip Technology, PIC16F616-H/ST Datasheet - Page 143

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PIC16F616-H/ST

Manufacturer Part Number
PIC16F616-H/ST
Description
1.75KB Flash, 64B RAM, 6 I/O, 8MHz Internal Oscillator 14 TSSOP 4.4mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F616-H/ST

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
14-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
15.0
Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by PORTA and PORTC (combined) ........................................................................... 90 mA
Maximum current sourced PORTA and PORTC (combined) ........................................................................... 90 mA
Note 1:
© 2009 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
I
OL
DD
).
with respect to V
IK
(1)
OK
(V
DD
............................................................................................................................... 800 mW
I
SS
(Vo < 0 or Vo >V
< 0 or V
pin ......................................................................................................................... 95 mA
pin ...................................................................................................................... 95 mA
SS
I
> V
(†)
................................................................................................... -0.3V to +6.5V
DD
SS
)...............................................................................................................± 20 mA
DD
PIC16F610/616/16HV610/616
........................................................................... -0.3V to (V
).........................................................................................................± 20 mA
DIS
= V
DD
x {I
DD
– ∑ I
OH
} + ∑ {(V
DD
– V
OH
) x I
DS41288F-page 143
OH
} + ∑(V
DD
+ 0.3V)
O
l x

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