PIC16F506-E/MG Microchip Technology, PIC16F506-E/MG Datasheet - Page 60

• Manufacturer Part Number: PIC16F506-E/MG
• Description: 1.5 KB Flash, 67 RAM, 12 I/O, Comparator, 8bit ADC 16 QFN 3x3x0.9mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F506-E/MG

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 11
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: FLASH
• Ram Size: 67 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-QFN
• Processor Series: PIC16F
• Core: PIC
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12F510/16F506
10.2
10.2.1
The PIC12F510/16F506 devices can be operated in up
to six different oscillator modes. The user can program
up
[PIC12F510], FOSC<2:0> [PIC16F506]). To select one
of these modes:
•LP:
•XT:
•HS:
•INTOSC: Internal 4/8 MHz Oscillator
•EXTRC:
•EC:
10.2.2
In HS (PIC16F506), XT or LP modes, a crystal or
ceramic resonator is connected to the (GP5/RB5)/
OSC1/(CLKIN) and (GP4/RB4)/OSC2/(CLKOUT) pins
to establish oscillation (Figure 10-1). The PIC12F510/
16F506 oscillator designs require the use of a parallel
cut crystal. Use of a series cut crystal may give a fre-
quency out of the crystal manufacturers specifications.
When in HS (PIC16F506), XT or LP modes, the device
can have an external clock source drive the (GP5/
RB5)/OSC1/CLKIN pin (Figure 10-2). When the part is
used in this fashion, the output drive levels on the
OSC2 pin are very weak. This pin should be left open
and unloaded. Also, when using this mode, the external
clock should observe the frequency limits for the clock
mode chosen (HS, XT or LP).
DS41268D-page 58
Note 1: This device has been designed to per-
to
2: The user should verify that the device
Oscillator Configurations
three
Crystal/Resonator
CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
Low-Power Crystal
High-Speed Crystal/Resonator
(PIC16F506 only)
External Resistor/Capacitor
External High-Speed Clock Input
(PIC16F506 only)
OSCILLATOR TYPES
form to the parameters of its data sheet.
It has been tested to an electrical
specification designed to determine its
conformance with these parameters.
Due to process differences in the
manufacture of this device, this device
may have different performance charac-
teristics than its earlier version. These
differences may cause this device to
perform differently in your application
than the earlier version of this device.
oscillator
expected. Adjusting the loading capacitor
values and/or the Oscillator mode may
be required.
Configuration
starts
and
bits
performs
(FOSC<1:0>
as
FIGURE 10-1:
FIGURE 10-2:
TABLE 10-1:
Note 1:
Clock from
ext. system
Note 1:
Type
HS
Osc.
XT
(2)
2:
C1
C2
2:
3:
(1)
(1)
Resonator
These values are for design guidance
only. Since each resonator has its own
characteristics, the user should consult
the resonator manufacturer for
appropriate values of external
components.
PIC16F506 only.
4.0 MHz
See Capacitor Selection tables for
recommended values of C1 and C2.
A series resistor (RS) may be required for AT
strip cut crystals.
RF approx. value = 10 MΩ.
16 MHz
Freq.
Open
RS
XTAL
(2)
CAPACITOR SELECTION FOR
CERAMIC RESONATORS –
PIC12F510/16F506
OSC2
OSC1
CRYSTAL OPERATION
(OR CERAMIC
RESONATOR)
(HS, XT OR LP OSC
CONFIGURATION)
EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR
LP OSC
CONFIGURATION)
© 2007 Microchip Technology Inc.
Cap. Range
10-47 pF
30 pF
OSC2
OSC1
C1
RF
(3)
PIC12F510
PIC16F506
(1)
PIC12F510
PIC16F506
Cap. Range
10-47 pF
To internal
Sleep
30 pF
C2
logic