HY82563EB S L7WG Intel, HY82563EB S L7WG Datasheet - Page 45

• Manufacturer Part Number: HY82563EB S L7WG
• Manufacturer: Intel

Specifications of HY82563EB S L7WG

• Lead Free Status / RoHS Status: Compliant

5.2
Table 38. Thermal Characteristics
Thermal Specifications
The 82563EB/82564EB device is specified for operation when the ambient temperature (T
within the range of 0
The maximum junction temperature is 120° C. The maximum ambient temperature with airflow
and/or a heatsink can be calculated using the thermal coefficient data below and the power
specification (see section 4.7)
T
T
P (power consumption) is calculated by using the typical I
V
C
J
CC
Symbol
(junction temperature) is calculated using the equation:
(case temperature) is calculated using the equation:
. The preliminary thermal resistances are shown in
T
T
θ
θ
C
J
J
J
A
C
= T
= T
A
A
+ P θ
+ P (θ
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon
JA
JA
°
C to 60
- θ
JC
)
Parameter
°
C.
Table
26.1
12.7
0
CC
Value @ Given Airflow (m/s)
, as indicated in
38.
22.9
1
-
21.7
2
-
Table
21.1
38, and nominal
3
-
°C/watt
°C/watt
A
Units
) is
39