RC82540EP Intel, RC82540EP Datasheet - Page 34

• Manufacturer Part Number: RC82540EP
• Manufacturer: Intel

Specifications of RC82540EP

• Operating Supply Voltage (typ): 1.5/2.5/3.3V
• Operating Supply Voltage (min): 1.43/2.38/3V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Lead Free Status / RoHS Status: Not Compliant

82540EP — Networking Silicon
5.2
28
Figure 11. Dimension Diagram for the 196-pin BGA
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Package Information
The 82540EP device is a 196-lead ball grid array (TFBGA) measuring 15 mm
dimensions are detailed in
0.32 +/-0.04
Substrate change from
0.36 mm to 0.32 mm
1.56 +/-0.19
Figure
0.40 +/-0.10
11. The nominal ball pitch is 1 mm. .
0.85
Note: All dimensions are in millimeters.
Seating Plate
30
o
2
. The package