GD82541PI Intel, GD82541PI Datasheet - Page 33

• Manufacturer Part Number: GD82541PI
• Manufacturer: Intel

Specifications of GD82541PI

• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 196
• Lead Free Status / RoHS Status: Not Compliant

5.0
5.1
Figure 11. 82541(PI/GI/EI) Mechanical Specifications
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Package Information
Package and Pinout Information
This section describes the 82541(PI/GI/EI) device physical characteristics. The pin number-to-
signal mapping is indicated beginning with
The 82541(PI/GI/EI) device is a 196-lead plastic ball grid array (BGA) measuring 15 mm by
15 mm. The package dimensions are detailed below. The nominal ball pitch is 1 mm.
0.32 +/-0.04
1.56 +/-0.19
0.40 +/-0.10
0.85
Table
14.
Networking Silicon — 82541(PI/GI/EI)
Seating Plate
30
o
33