TJA1054AT NXP Semiconductors, TJA1054AT Datasheet - Page 22

• Manufacturer Part Number: TJA1054AT
• Description: TRANSCEIVER, CAN FAULT TOL, SO-14
• Manufacturer: NXP Semiconductors

Specifications of TJA1054AT

• Number Of Transceivers: 1
• Power Down Mode: Sleep/Standby
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Package Type: SO
• Supply Current: 0.125/27mA
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 14
• Supply Voltage Range: 4.75V To 5.25V
• Operating Temperature Range: -40°C To +150°C
• Digital Ic Case Style: SOIC
• No. Of Pins: 14
• Svhc: No SVHC (18-Jun-2010)
• Package / Case: SO
• Base Number: 1054
• Supply: RoHS Compliant
• Ic Function: CAN Transceiver
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
TJA1054A
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 11.
Table 12.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 11
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
12
10.
Rev. 5 — 3 August 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
10) than a SnPb process, thus
Fault-tolerant CAN transceiver
≥ 350
220
220
TJA1054A
245
> 2000
260
245
© NXP B.V. 2010. All rights reserved.
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