TLF14CB1230R6 Taiyo Yuden, TLF14CB1230R6 Datasheet - Page 7
TLF14CB1230R6
Manufacturer Part Number
TLF14CB1230R6
Description
CHOKE COMMON MODE 12000UH
Manufacturer
Taiyo Yuden
Series
TLF14CBr
Datasheet
1.TLF9UA102W0R8.pdf
(10 pages)
Specifications of TLF14CB1230R6
Inductance
12mH
Current
600mA
Filter Type
Common Mode - 2 Line Array
Package / Case
0.867" L x 0.669" W x 0.906" H (22.00mm x 17.00mm x 23.00mm)
Mounting Type
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Impedance
-
Dc Resistance (dcr)
-
△
10.Withstanding:
11.Withstanding:
12.Rated voltage
13.Resistance to vibration
14.Solderability
15.Resistance to soldering
!
RELIABILITY DATA
between wires
between wires and core
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
heat
Item
No abnormality
Within the specified range
At least 75% of terminal electrode is covered by
new solder.
Appearance:No abnormality
Impedance change : Refer to individual specifi-
cation
BUーRA Type
CMーRA/
Appearance:
No abnormality
Inductance change:
Within±15%
CMーRB Type
Specified Value
No abnormality
TLF9U
Inductance change:
Within±5%
TLF14CB
Within the specified
range
Solder shall be uniformly adhered onto im-
mersed surfaces.
TLF9UA・TLF25RA:
Inductance change:Within±5%
TLF14CB
Within the specified range
TLF14CB
TLF9U
TLF25RA
△
!
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
CM・TLF:
Applied voltage:250VDC (CMーRA/BUーRA、CMーRB)
Duration:60sec.
TLF:
Applied voltage:2000VAC (TLF9UA、14CB)
Duration:60sec.
TLF9UA, 14CB, 25RA:250VAC
TLF9UB:50VDC
CM,TLF:
According to JIS C0040
Direction:2hrs each in X, Y and Z direction Total:6hrs
Frequency range:10 to 55 to 10Hz (1 min.)
Amplitude: 1.5mm (shall not exceed acceleration 196m
Mounting method:soldering onto PC board
Recovery:2 to 24 hrs of recovery under the standard
CM:
Solder temperature:235±5℃
Duration:2±0.5sec.
Immersion depth:According to detailed specification.
TLF:
Solder temperature:230±5℃
Duration:2±0.5sec. ( 9U、25RA)
Immersion depth:Up to 1.0 to 1.5mm from PBC mount-
CM:
Solder temperature:260±5℃
Duration:5±0.5sec.
Immersion depth:Up to 2∼2.5mm from terminal root.
Recovery:1 to 2 hrs of recovery under the standard
TLF:
Solder temperature:260±5℃
Duration:5±1sec. ( 25RA)
Immersion depth:Up to 1.0 to 1.5mm from PBC mount-
Recovery : At least 1hr of recovery under the standard
:10±1sec. ( 9U、14CB)
:3±0.5sec. ( 14CB)
: At least 1hr of recovery under the standard
condition after the test. (CMーRB)
condition after the removal from test cham-
ber, followed by the measurement within
2hrs. (TLF9U、14CB)
condition after the test.
condition after the removal from test chamber,
followed by the measurement within 2hrs.
:2000VAC (TLF9UA、14CB、25RA)
:500VDC (TLF 9UB)
Test method and remarks
:500VDC (TLF9UB)
ed level.
ed level.
2/4
2
/s)
403
5