TLF14CB1230R6 Taiyo Yuden, TLF14CB1230R6 Datasheet - Page 7

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TLF14CB1230R6

Manufacturer Part Number
TLF14CB1230R6
Description
CHOKE COMMON MODE 12000UH
Manufacturer
Taiyo Yuden
Series
TLF14CBr
Datasheet

Specifications of TLF14CB1230R6

Inductance
12mH
Current
600mA
Filter Type
Common Mode - 2 Line Array
Package / Case
0.867" L x 0.669" W x 0.906" H (22.00mm x 17.00mm x 23.00mm)
Mounting Type
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Impedance
-
Dc Resistance (dcr)
-
10.Withstanding:
11.Withstanding:
12.Rated voltage
13.Resistance to vibration
14.Solderability
15.Resistance to soldering
RELIABILITY DATA 
between wires
between wires and core
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
heat
Item
No abnormality
Within the specified range
At least 75% of terminal electrode is covered by
new solder.
Appearance:No abnormality
Impedance change : Refer to individual specifi-
cation
BUーRA Type
CMーRA/
Appearance:
No abnormality
Inductance change:
Within±15%
CMーRB Type
Specified Value
No abnormality
TLF9U
Inductance change:
Within±5%
TLF14CB
Within the specified
range
Solder shall be uniformly adhered onto im-
mersed surfaces.
TLF9UA・TLF25RA:
Inductance change:Within±5%
TLF14CB
Within the specified range
TLF14CB
TLF9U
TLF25RA
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
CM・TLF:
Applied voltage:250VDC (CMーRA/BUーRA、CMーRB)
Duration:60sec.
TLF:
Applied voltage:2000VAC (TLF9UA、14CB)
Duration:60sec.
TLF9UA, 14CB, 25RA:250VAC
TLF9UB:50VDC
CM,TLF:
According to JIS C0040
Direction:2hrs each in X, Y and Z direction Total:6hrs
Frequency range:10 to 55 to 10Hz (1 min.)
Amplitude: 1.5mm (shall not exceed acceleration 196m
Mounting method:soldering onto PC board
Recovery:2 to 24 hrs of recovery under the standard
CM:
Solder temperature:235±5℃
Duration:2±0.5sec.
Immersion depth:According to detailed specification.
TLF:
Solder temperature:230±5℃
Duration:2±0.5sec. ( 9U、25RA)
Immersion depth:Up to 1.0 to 1.5mm from PBC mount-
CM:
Solder temperature:260±5℃
Duration:5±0.5sec.
Immersion depth:Up to 2∼2.5mm from terminal root.
Recovery:1 to 2 hrs of recovery under the standard
TLF:
Solder temperature:260±5℃
Duration:5±1sec. ( 25RA)
Immersion depth:Up to 1.0 to 1.5mm from PBC mount-
Recovery : At least 1hr of recovery under the standard
:10±1sec. ( 9U、14CB)
:3±0.5sec. ( 14CB)
: At least 1hr of recovery under the standard
condition after the test. (CMーRB)
condition after the removal from test cham-
ber, followed by the measurement within
2hrs. (TLF9U、14CB)
condition after the test.
condition after the removal from test chamber,
followed by the measurement within 2hrs.
:2000VAC (TLF9UA、14CB、25RA)
:500VDC (TLF 9UB)
Test method and remarks
:500VDC (TLF9UB)
ed level.
ed level.
2/4
2
/s)
403
5

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