HP3-TO3-CB CTS Thermal Management Products, HP3-TO3-CB Datasheet - Page 5

• Manufacturer Part Number: HP3-TO3-CB
• Description: HEATSINK PWR 1.0"H BLACK TO-3
• Manufacturer: CTS Thermal Management Products
• Series: HP3r

Specifications of HP3-TO3-CB

• Package Cooled: TO-3
• Attachment Method: Bolt On
• Outline: 79.24mm x 79.24mm
• Height: 1.000" (25.40mm)
• Thermal Resistance @ Natural: 4.4°C/W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Other names: 294-1089

17. Hole pattern no. 202 accommodates T0-3 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
19. Hole pattern no. 2 accommodates T0-6s or T0-36s.
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
27. Hole pattern no. 420 (Universal) accommodates T0-3s, T0-
66s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2,
HP1, and HP3 series heat dissipators.
18. Hole pattern no. 436 accomodates T0-3s (4-pin). Available
in UP, UP1, UP2, HP1, and HP3 series heat dissipators.
23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other
1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and
HP3 series heat dissipators.
31. Hole pattern no. 213 accommodates one TO-3 (panel
mounted). Available in HP1 and HP3 series heat dissipators
only.