HP3-TO3-CB CTS Thermal Management Products, HP3-TO3-CB Datasheet - Page 2

• Manufacturer Part Number: HP3-TO3-CB
• Description: HEATSINK PWR 1.0"H BLACK TO-3
• Manufacturer: CTS Thermal Management Products
• Series: HP3r

Specifications of HP3-TO3-CB

• Package Cooled: TO-3
• Attachment Method: Bolt On
• Outline: 79.24mm x 79.24mm
• Height: 1.000" (25.40mm)
• Thermal Resistance @ Natural: 4.4°C/W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Other names: 294-1089

HP3-T03-44U
HP3-436-U
HP3-T015-U
HP3-T06-U
HP3-420-U
HP3 for Dual TO-3 Outline
Ordering Information
HP3-T03-4U
HP3-437-U
Unplated
•
•
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
Derate 2.0 °C/watt for unplated part in natural convection only.
CTS IERC PART NO.
HP3-T03-44CB
HP3-436-CB
HP3-T015-CB
HP3-T06-CB
HP3-420-CB
HP3-T03-4CB
HP3-437-CB
Comm'l. Black
Anodize
HP3-T03-44B
HP3-436-B
HP3-T015-B
HP3-T06-B
HP3-420-B
Mil. Black Anodize
HP3-T03-4B
HP3-437-B
T0-3 PANEL MOUNT
T0-3 (4 PIN)
T0-15, D0-5
T0-6, T0-36
UNIVERSAL
Two TO-3s
Two TO-3s (4 pin)
Accommodated
Semiconductor
Hole patt. ref.
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
no.
31
18
23
19
27
12
6
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Max. Weight
(Grams)
55.0
55.0
55.0
55.0
55.0
55.0
55.0