274-1AB Wakefield Thermal Solutions, 274-1AB Datasheet - Page 6
![HEATSINK TO-220 LOW HEIGHT BLK](/photos/5/88/58821/274-1ab_sml.jpg)
274-1AB
Manufacturer Part Number
274-1AB
Description
HEATSINK TO-220 LOW HEIGHT BLK
Manufacturer
Wakefield Thermal Solutions
Series
274r
Specifications of 274-1AB
Thermal Resistance
8 C / W
Height
0.375" (9.53mm)
Color
Black
Package Cooled
TO-220
Attachment Method
Bolt On and PC Pin
Outline
19.05mm x 13.21mm
Power Dissipation @ Temperature Rise
2W @ 56°C
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 400 LFM
Thermal Resistance @ Natural
28°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
13.21 mm L x 9.53 mm W x 19.05 mm H
Designed For
TO-220
Packages Cooled
TO-220
Width
19.1mm
Heat Sink Material
Aluminum
Length
13.2mm
Mounting Type
Screw
Package / Case
TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1023
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
274-1AB
Manufacturer:
WAK
Quantity:
13 432
WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PATENT PENDING
PATENT 5381041
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
6/14/07
239-75AB
10:55 AM
Standard
P/N
235-85AB
235-85ABE-01
235-85ABE-05
235-85ABE-10
Material: Aluminum, Black Anodized
Standard
P/N
243-1PAB
243-3PAB
Material: Aluminum, Pre-anodized Black
Standard
P/N
239-75AB
239-75ABE-03
239-75ABE-04
Material: Aluminum, Black Anodized
235 SERIES
243 SERIES
239 SERIES
235-85AB-05
Page 27
243 SERIES
Height Above
Height Above
Height Above
Dimensions: in. (mm)
1.000 (25.4)
.850 (21.6)
.850 (21.6)
.500 (12.7)
.975 (24.8)
.750 (19.1)
.750 (19.1)
.750 (19.1)
.800 (20.3)
PC Board
PC Board
PC Board
in. (mm)
in. (mm)
in. (mm)
235-85AB
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Snap-Down Self-Locking Heat Sinks
Labor-Saving Clip-On Heat Sinks
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
.850 (21.6) x 1.000 (25.4)
MECHANICAL DIMENSIONS
.800 (20.3) x .270 (6.9)
.800 (20.3) x .270 (6.9)
SECTION A-A
Dimensions
Dimensions
Dimensions
Dimensions: in. (mm)
Footprint
Footprint
Footprint
in. (mm)
in. (mm)
in. (mm)
235-85AB-01
Configuration
Configuration
Configuration
SECTION A-A
Vert./Horiz.
Vert./Horiz.
Verl./Horiz.
239-75AB-03
Vert./Horiz
239-75AB-04
Mounting
Horizontal
Mounting
Mounting
239 SERIES
Vertical
Vertical
Vertical
Vertical
235-85AB-10
235 SERIES
Tab Options
Tab Options
Tab Options
Solderable
Solderable
Solderable
No Tab
No Tab
No Tab
No Tab
01
05
10
03
04
VIEW B-B
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Mounting
Mounting
Style
Style
Style
Clip
Clip
Convection
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
Convection
Convection
38°C @ 2W
38°C @ 2W
38°C @ 2W
Thermal Performance at Typical Load
Thermal Performance at Typical Load
50°C@ 2W
78°C@ 2W
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
Natural
Natural
Natural
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
Board Level
Heat Sinks
Convection
Convection
Convection
Forced
Forced
Forced
TO-220
TO-220
TO-220
27