274-1AB Wakefield Thermal Solutions, 274-1AB Datasheet - Page 23
![HEATSINK TO-220 LOW HEIGHT BLK](/photos/5/88/58821/274-1ab_sml.jpg)
274-1AB
Manufacturer Part Number
274-1AB
Description
HEATSINK TO-220 LOW HEIGHT BLK
Manufacturer
Wakefield Thermal Solutions
Series
274r
Specifications of 274-1AB
Thermal Resistance
8 C / W
Height
0.375" (9.53mm)
Color
Black
Package Cooled
TO-220
Attachment Method
Bolt On and PC Pin
Outline
19.05mm x 13.21mm
Power Dissipation @ Temperature Rise
2W @ 56°C
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 400 LFM
Thermal Resistance @ Natural
28°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
13.21 mm L x 9.53 mm W x 19.05 mm H
Designed For
TO-220
Packages Cooled
TO-220
Width
19.1mm
Heat Sink Material
Aluminum
Length
13.2mm
Mounting Type
Screw
Package / Case
TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1023
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
274-1AB
Manufacturer:
WAK
Quantity:
13 432
WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
44
MECHANICAL
DIMENSIONS
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
(EXTRUSION PROFILE 1284)
6/14/07
601 SERIES
Standard
P/N
601E
601F
601K
603K
Material: Aluminum Alloy, Black Anodized
Standard
P/N
641A
641K
601 & 603 SERIES
641 SERIES
10:56 AM
(EXTRUSION PROFILE 1371)
641 SERIES
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 2.000 (50.8)
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Page 44
Dimensions
Dimensions
in. (mm)
Footprint
in. (mm)
Outline
K
Low-Height Heat Sinks
1.000 (25.4)
1.000 (25.4)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
in. (mm)
in. (mm)
SEMICONDUCTOR MOUNTING HOLES
Height
Height
(EXTRUSION PROFILE 1284)
SEMICONDUCTOR MOUNTING HOLES
603 SERIES
A
dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or
brackets using isolation hardware where necessary.
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black An-
odized.
E
Mounting
(1) TO-3
0.200 (5.1)
0.270 (6.9)
Mounting
Pattern
Hole Dia.
in. (mm)
None
Hole
None
None
K
52°C @ 5.0W
52°C @ 5.0W
52°C @ 5.0W
41°C @ 5.0W
Thermal Performance at Typical Load
Convection
36°C @ 15W
36°C @ 15W
Convection
Natural
Thermal Performance at Typical Load
Natural
CONVECTION CHARACTERISTICS
F
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.0°C/W @ 175 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
NATURAL AND FORCED
Convection
Convection
Forced
Forced
DO-4/DO-5 Diodes
0.2900 (131.54)
0.2900 (131.54)
0.0500 (22.68)
0.0500 (22.68)
0.0500 (22.68)
0.0810 (36.74)
lbs. (grams)
lbs. (grams)
Weight
Weight
TO-3