330SC Wakefield Thermal Solutions, 330SC Datasheet - Page 5

• Manufacturer Part Number: 330SC
• Description: SPEEDCLIP S/S FOR 667 SERIES
• Manufacturer: Wakefield Thermal Solutions
• Series: 667r

Specifications of 330SC

• Accessory Type: Clip(s)
• Rohs Compliant: YES
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: 345-1037
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 330-SC; 345-1039

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Material: Aluminum,
Black Anodized
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
240-118ABH-22
273-AB
274 SERIES
281 SERIES
273 SERIES
Standard
P/N
273-AB
273-AB-01
273-AB-02
Material: Aluminum, Black Anodized
274 SERIES
Standard
P/N
274-1AB
274-1AB-01
274-1AB-02
274-2AB
274-2AB-01
274-2AB-02
274-3AB
274-3AB-01
274-3AB-02
281-1AB
281-2AB
240 SERIES
Standard
P/N
240-118ABH-22
240-118ABS-22
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
240-118ABS-22
Height Above
Height Above
Low-Cost, Low-Height Wavesolderable Heat Sinks
Low-Cost, Low-Height Wavesolderable Heat Sinks
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
Labor-Saving Twisted Fin Heat Sinks
.375 (9.5)
.375 (9.5)
.375 (9.5)
PC Board
PC Board
in. (mm)
in. (mm)
Height Above
1.180 (30.0)
1.180 (30.0)
PC Board
in. (mm)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
273-AB-01
Dimensions
Dimensions
Footprint
Footprint
in. (mm)
in. (mm)
Dimensions
Footprint
in. (mm)
240 SERIES
Dimensions: in. (mm)
273 SERIES
274 SERIES
274-XAB-01
34
Configuration
Configuration
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Mounting
Mounting
Configuration
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Mounting
Vertical
Vertical
273-AB-02
Tab Options
Tab Options
Solderable
Solderable
Tab Options
Solderable
No Tab
No Tab
No Tab
No Tab
No Tab
No Tab
01
02
01
02
01
02
01
02
22
22
274-XAB-02
Clip/Mtg Hole
Clip/Mtg Slot
Mounting
Mounting
Mounting
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Style
Style
Style
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
49°C @ 2W
62°C @ 2W
55°C @ 4W
55°C @ 4W
Convection
49°C @ 2W
49°C @ 2W
56°C @ 2W
56°C @ 2W
56°C @ 2W
50°C @ 2W
50°C @ 2W
50°C @ 2W
62°C @ 2W
62°C @ 2W
56°C @ 2W
50°C @ 2W
NATURAL AND FORCED
Convection
Thermal Performance at Typical Load
Thermal Performance at Typical Load
Convection
Thermal Performance at Typical Load
NATURAL AND FORCED
Natural
Natural
Natural
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
Convection
Convection
Convection
TO-218, TO-220
Forced
Forced
Forced
Normally stocked
TO-220
TO-220