330SC Wakefield Thermal Solutions, 330SC Datasheet - Page 12
330SC
Manufacturer Part Number
330SC
Description
SPEEDCLIP S/S FOR 667 SERIES
Manufacturer
Wakefield Thermal Solutions
Series
667r
Datasheet
1.274-2AB.pdf
(20 pages)
Specifications of 330SC
Accessory Type
Clip(s)
Rohs Compliant
YES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
345-1037
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
330-SC
345-1039
345-1039
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-
drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili-
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards.
Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL
DIMENSIONS
Normally stocked
286 SERIES
Standard
P/N
286-AB
286-CBT
286-CT
287 SERIES
Mounting Slot
287-1AB
287-2AB
Material: Aluminum, Black Anodized
695 SERIES
Standard
P/N
695-1B
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
Standard P/N
Height Above
1.190 (30.2)
1.190 (30.2)
1.190 (30.2)
PC Board
in. (mm)
Mounting Hole
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Wave-Solderable Low-Cost Heat Sinks
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
287-1ABH
287-2ABH
1.330 (33.8)
Maximum
in. (mm)
Width
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
Maximum Footprint
Height Above
1.180 (30.0)
1.180 (30.0)
in. (mm)
PC Board
in. (mm)
0.530 (13.7)
695 SERIES
in. (mm)
Height
286 SERIES
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 1.000 (25.4)
41
Aluminum, Anodized
Footprint “A”
Copper, Tinned
t y. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,
Maximum
black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
Copper, Black
in. (mm)
287 SERIES
Material
Standard P/N
287-1AB
287-2AB
287-1ABH
287-2ABH
72°C @ 4.0W
Convection
Thermal Performance at Typical Load
Natural
provides good heat dissipation for use where height is limited above the print-
ed circuit board or base plate.
0.500 (12.7)
1.000 (25.4)
0.500 (12.7)
1.000 (25.4)
All other products, please contact factory for price, delivery, and minimums.
Dim. “A”
58°C @ 4W
58°C @ 4W
58°C @ 4W
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
55°10 @ 4W
65°C @ 4W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
5.2°C/W @ 400 LFM
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
Convection
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
Forced
7.8°CW @ 200 LFM
6.4°CW @ 200 LFM
Convection
Convection
Forced
Forced
Board Level
Heat Sinks
0.0250 (11.34)
0.0250 (11.34)
0.0090 (4.08)
0.0140 (6.35)
0.0085 (3.86)
lbs. (grams)
STUD-MOUNT
lbs. (grams)
0.0030 (1.36)
Weight
lbs. (grams)
TO-220
Weight
TO-220
Weight