BCM62B,215 NXP Semiconductors, BCM62B,215 Datasheet
BCM62B,215
Specifications of BCM62B,215
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BCM62B,215 Summary of contents
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BCM62B PNP/PNP matched double transistor Rev. 02 — 28 August 2009 1. Product profile 1.1 General description PNP/PNP matched double transistor in a SOT143B small Surface-Mounted Device (SMD) plastic package. Matched version of BCV62. NPN/NPN equivalent: BCM61B 1.2 Features I ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BCM62B 4. Marking Table 4. Type number BCM62B [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BCM62B_2 Product data sheet Pinning Description collector TR2, base TR1 and TR2 collector TR1 ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor TR1 V CBO V CEO Per transistor V EBS tot Per device P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Per transistor TR1 I CBO I EBO CEsat V BEsat BCM62B_2 Product data sheet Characteristics Parameter Conditions collector-base cut-off current 150 C j emitter-base cut-off current current gain 100 collector-emitter mA; C saturation voltage 100 mA; ...
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... NXP Semiconductors Table unless otherwise specified. amb Symbol Per transistor TR2 V EBS Per device [1] V BEsat [ [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BCM62B_2 Product data sheet Characteristics …continued Parameter Conditions emitter-base voltage 250 current matching ...
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... NXP Semiconductors 0.20 I (mA 2.25 (A) 2 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values 1.3 V BEsat (V) 0.9 (1) (2) (3) 0 amb ( amb ( 100 C amb Fig 3. Base-emitter saturation voltage as a function of collector current; typical values BCM62B_2 Product data sheet 006aaa832 1 ...
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... NXP Semiconductors 1 (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF MHz amb Fig 7. Collector capacitance as a function of collector-base voltage; typical values BCM62B_2 Product data sheet 006aaa836 f (MHz (mA) C Fig 6. 006aaa838 C (pF (V) CB Fig 8. Rev. 02 — 28 August 2009 ...
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... NXP Semiconductors (1) V (2) V (3) V Fig 9. 8. Test information Fig 10. Test circuit current matching BCM62B_2 Product data sheet 1 1.3 1.1 0 CE1 = 3 V CE1 = 1 V CE1 Current matching as a function of emitter current 2; typical values CE1 TR1 Rev. 02 — 28 August 2009 BCM62B PNP/PNP matched double transistor ...
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... NXP Semiconductors 9. Package outline Fig 11. Package outline SOT143B 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BCM62B [1] For further information and the availability of packing methods, see BCM62B_2 Product data sheet 3.0 2 ...
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... NXP Semiconductors 11. Soldering Fig 12. Reflow soldering footprint SOT143B Fig 13. Wave soldering footprint SOT143B BCM62B_2 Product data sheet 3.25 0.60 (3x) 0.50 (3x) 0.60 (4x 2. 0.90 1.00 2.50 Dimensions in mm 4.45 1. 1.00 3.40 Dimensions in mm Rev. 02 — 28 August 2009 BCM62B PNP/PNP matched double transistor ...
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... Revision history Document ID Release date BCM62B_2 20090828 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 13 “Wave soldering footprint BCM62B_1 20060919 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history ...