BCR 153L3 E6327 Infineon Technologies, BCR 153L3 E6327 Datasheet
BCR 153L3 E6327
Specifications of BCR 153L3 E6327
SP000014866
Related parts for BCR 153L3 E6327
BCR 153L3 E6327 Summary of contents
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PNP Silicon Digital Transistor Switching circuit, inverter, interface circuit, driver circuit Built in resistor (R =2. BCR153U: Two internally isolated transistors with good matching in one multichip package BCR153F/L3 BCR153T ...
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Thermal Resistance Parameter 1) Junction - soldering point BCR153F BCR153L3 BCR153T Electrical Characteristics at T Parameter DC Characteristics Collector-emitter breakdown voltage I = 100 µ Collector-base breakdown voltage µ ...
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DC current gain (common emitter configuration Input on Voltage (on 0.3V (common ...
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Total power dissipation P BCR153F 300 mW 250 225 200 175 150 125 100 Total power dissipation P BCR153T 300 mW 250 225 200 175 150 125 100 75 50 ...
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Permissible Puls Load R thJS BCR153F 2 10 K/W D=0 0.2 0.1 0.05 0.02 0.01 0.005 Permissible Puls Load R thJS BCR153L3 ...
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Permissible Puls Load R thJS BCR153T D=0.5 0.2 0.1 0.05 0. 0.01 0.005 Permissible Pulse Load p ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SC75 1.6 ±0.2 +0.1 0.2 0.1 MAX. -0. +0.1 0.2 -0.05 0.5 ...
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Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 Month ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package TSFP-3 1.2 ±0.05 0.2 0.55 ±0.05 ±0. 0.2 0.15 ±0.05 0.4 ±0.05 0.4 ...
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Package Outline Top view Pin 1 marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.6 0.225 0.15 Copper Marking Layout Standard Packing Reel ø180 mm = ...
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... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...