C702 10M008 1214 Amphenol, C702 10M008 1214 Datasheet - Page 38
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C702 10M008 1214
Manufacturer Part Number
C702 10M008 1214
Description
Manufacturer
Amphenol
Type
Smart Cardr
Datasheet
1.C702_10M008_1214.pdf
(60 pages)
Specifications of C702 10M008 1214
Ejector Type
Pushmatic
Gender
HDR
Mounting Style
Through Hole
Termination Method
Solder
Body Orientation
Right Angle
Contact Pitch (mm)
2.54mm
Number Of Contact Rows
2
Number Of Contacts
16POS
Operating Temp Range
-25C to 85C
Insertion Force
12
Product Height (mm)
6.4mm
Product Depth (mm)
50.1mm
Product Length (mm)
64.5mm
Contact Pitch
2.54mm
Lead Free Status / RoHS Status
Compliant
38
C702E Smart Card Connectors with PCB Mount Wiping Contacts
C702E Technical Data
Electrical Characteristics
Contact resistance
without cable or flexprint
Insulation resistance
High voltage resistance
Climatical Characteristics
Climatic category
Operating temperature
Storage temperature
Mechanical Characteristics
Card insertion force
Card extraction force
Mechanical lifetime
Vibration
Shock, without disconnection
Shock, without destruction
Contact force
Switch
Card presence switch
Switch sequence
Chattering time
6,8
Standard
IEC 60512-2, Test 2a
IEC 60512-2, Test 3a
IEC 60512-2, Test 4a
IEC 60068-1
IEC 60512-7, Test 13b
IEC 60512-7, Test 13b
IEC 60512-5, Test 9a
(without corrosion stress)
IEC 60512-4, Test 6d
IEC 60512-4, Test 6c
IEC 60512-4, Test 6c
The card presence switch is activated after the data contacts have mated with the contact field and
before the card reaches its final position.
3,2
Description
with board lock,
self-cleaning switch
and card guide
66
26
Contact position
ISO
ISO + AFNOR
Value
Data contacts
Switch contacts
500 V
25 / 70 / 21
- 25 °C ... + 70 °C
- 40 °C ... + 85 °C
100,000 mating cycles
f = 10 ... 60 Hz
f = 60 ... 500 Hz
2 h / axis
3 shocks / direction in 3 axis
200 g; 6 ms; halfsine
2 shocks / direction in 3 axis
20 ... 50 cN
normally closed
10
5 N
1 N
40 g; 11 ms; halfsine
5 ms
9
24,5
AC
; 1 min
0,4
LEITERPLATTENDICKE / PCB THICKNESS = 1,4 - 1,68
30 m
Termination
Dip solder pin
Dip solder pin
BESTÜCKUNGSSEITE / COMPONENTS SIDE
ø0,1
12 N at “dual plane“ 2 x 8 contacts
4,05
50 m
0,35 mm DA
a = 2.5 g
10
S
C4
C3
C2
C1
C5
C6
C7
C8
S
ø3,2
38,1
20
30
ø0,1
+0,1
-0,0
C8
C7
C6
C5
C1
C2
C3
C4
(66)
Part No.
C702 10M008 226 4
C702 10M008 235 4
ø1
+0,1
-0,0