C702 10M008 1214 Amphenol, C702 10M008 1214 Datasheet - Page 31

• Manufacturer Part Number: C702 10M008 1214
• Manufacturer: Amphenol
• Type: Smart Cardr

Specifications of C702 10M008 1214

• Ejector Type: Pushmatic
• Gender: HDR
• Mounting Style: Through Hole
• Termination Method: Solder
• Body Orientation: Right Angle
• Contact Pitch (mm): 2.54mm
• Number Of Contact Rows: 2
• Number Of Contacts: 16POS
• Operating Temp Range: -25C to 85C
• Insertion Force: 12
• Product Height (mm): 6.4mm
• Product Depth (mm): 50.1mm
• Product Length (mm): 64.5mm
• Contact Pitch: 2.54mm
• Lead Free Status / RoHS Status: Compliant

Smart Card Connectors
with PCB Mount Wiping Contacts
Series C702E
with board locks,
dip solder pins and
self-cleaning switch
with board locks,
dip solder pins,
3 mm stand-offs and
self-cleaning switch
with board locks,
dual plane, 2 x 8 contacts,
dip solder pins and
self-cleaning switch
with board locks,
dip solder pins,
3 mm stand-offs, self-cleaning
switch and card guide
with board locks,
dip solder pins,
self-cleaning switch and
card guide
with board locks, Page 34,35
dip solder pins,
self-cleaning switch,
“double decker”
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Page 32
Page 33
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Page 34
Screw/Rivet mounting Page 36
with board locks
and dip solder pins
with board locks,
SMT and self-cleaning
switch
with board locks,
SMT, self-cleaning switch
and card guide
with board locks,
dip solder pins,
self-cleaning switch and
card guide
Page 36
Page 37
Page 37
Page 38
PCB Mount Wiping Contact Smart Card
Connectors
Typical applications for Smart Card
Connectors with wiping contacts and PCB
mounting are set top boxes, toll road trans-
poders, parking meters, utility metering
systems, etc., where limited numbers of
mating cycles are specified.
Design features
• Termination: dip solder pins or SMT
• self-cleaning card presence switch on
• special shape of wiping contacts minimize
• Versions acc. to EMV (see page 6)
• dual plane version with 2 x 8 contacts for
most models detecting final card position
card scratching and wear
chip up & down card handling, suitable for
applications with short dwell time of the
card
Assembly instructions:
Soldering conditions
• wave soldering: 260 °C; 10 s max.
• infrared reflow 230 °C; 30 s max.
(SMT versions only)
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