TJA1020TD NXP Semiconductors, TJA1020TD Datasheet - Page 16

RF Transceiver LIN TRANSCEIVER

TJA1020TD

Manufacturer Part Number
TJA1020TD
Description
RF Transceiver LIN TRANSCEIVER
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TJA1020TD

Number Of Receivers
4
Number Of Transmitters
3
Operating Supply Voltage
5 V to 27 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SO-8
Maximum Data Rate
0.02 MBd
Maximum Supply Current
8 mA
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TJA1020T/N1,112
Philips Semiconductors
BONDING PAD LOCATIONS
Table 2 Bonding pad locations (dimensions in m). All x and y co-ordinates are referenced to the bottom left hand
2004 Jan 13
handbook, full pagewidth
RXD
NSLP
NWAKE
TXD
GND1
GND2
GND3
LIN
BAT
INH
LIN transceiver
corner of the top aluminium layer.
SYMBOL
0
0
PAD
5A
5B
5C
1
2
1
2
3
4
6
7
8
Fig.10 Bonding pad locations.
4
3
y
16
x
8
5A 5B 5C
1075
1185
1295
1318
1235
1125
111
111
165
134
7
x
6
MGW322
CO-ORDINATES
Product specification
1570
1395
1133
1490
424
134
419
90
90
90
TJA1020
y

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