PUML1,115 NXP Semiconductors, PUML1,115 Datasheet
![TRANS ARRAY NPN W/RES SC-88](/photos/5/32/53200/sot363_sml.jpg)
PUML1,115
Specifications of PUML1,115
Related parts for PUML1,115
PUML1,115 Summary of contents
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PUML1/ 200 mA NPN general-purpose transistor/ 100 mA NPN resistor-equipped transistor Rev. 01 — 14 July 2008 1. Product profile 1.1 General description NPN general-purpose transistor and NPN Resistor-Equipped Transistor (RET) in one SOT363 (SC-88) very small Surface-Mounted ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PUML1/DG 4. Marking Table 4. Type number PUML1/DG [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot TR2 (resistor-equipped transistor) V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Fig 1. ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol Per transistor R th(j-a) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint duty cycle = 1 Z th(j-a) 0.75 ( K/W ) 0.5 0.33 2 0.2 10 0.1 0.05 0. FR4 PCB, standard footprint Fig 2. ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Parameter TR1 (general-purpose transistor) I CBO I EBO CEsat TR2 (resistor-equipped transistor) I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ PUML1_DG_1 Product data sheet 50 V, 200 mA NPN general-purpose transistor/100 mA NPN RET Characteristics Conditions collector-base cut-off ...
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... NXP Semiconductors 500 h FE (1) 400 300 (2) 200 (3) 100 ( 150 C amb ( amb ( amb Fig 3. TR1: DC current gain as a function of collector current; typical values 1.3 V BEsat (V) (1) 0.9 (2) (3) 0 amb ( amb ( 150 C amb Fig 5. TR1: Base-emitter saturation voltage as a function of collector current; typical values ...
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... NXP Semiconductors ( 150 C amb ( amb ( amb Fig 7. TR2: DC current gain as a function of collector current; typical values 10 V I(on) (V) (1) ( amb ( amb ( 100 C amb Fig 9. TR2: On-state input voltage as a function of collector current; typical values PUML1_DG_1 Product data sheet 50 V, 200 mA NPN general-purpose transistor/100 mA NPN RET ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. 9. Package outline Fig 11. Package outline SOT363 (SC-88) 10 ...
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... NXP Semiconductors 11. Soldering Fig 12. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 13. Wave soldering footprint SOT363 (SC-88) PUML1_DG_1 Product data sheet 50 V, 200 mA NPN general-purpose transistor/100 mA NPN RET 2.65 1.5 2.35 0 1.8 1.3 1.3 2.45 5.3 Rev. 01 — 14 July 2008 PUML1/DG 0 ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PUML1_DG_1 20080714 PUML1_DG_1 Product data sheet 50 V, 200 mA NPN general-purpose transistor/100 mA NPN RET Data sheet status Change notice Product data sheet - Rev. 01 — 14 July 2008 PUML1/DG Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering ...