XC3S1600E-5FGG400C Xilinx Inc, XC3S1600E-5FGG400C Datasheet - Page 99

FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 657MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA

XC3S1600E-5FGG400C

Manufacturer Part Number
XC3S1600E-5FGG400C
Description
FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 657MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S1600E-5FGG400C

Package
400FBGA
Family Name
Spartan®-3E
Device Logic Cells
33192
Device Logic Units
3688
Device System Gates
1600000
Number Of Registers
29504
Maximum Internal Frequency
657 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
304
Ram Bits
663552
Number Of Logic Elements/cells
33192
Number Of Labs/clbs
3688
Total Ram Bits
663552
Number Of I /o
304
Number Of Gates
1600000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
400-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
HW-XA3S1600E-UNI-G - KIT DEVELOPMENT AUTOMOTIVE ECU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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The mode select pins, M[2:0], are sampled when the
FPGA’s INIT_B output goes High and must be at defined
logic levels during this time. After configuration, when the
FPGA’s DONE output goes High, the mode pins are avail-
able as full-featured user-I/O pins.
enable pull-up resistors on all user-I/O pins or High to dis-
able the pull-up resistors. The HSWAP control must remain
at a constant logic level throughout FPGA configuration.
After configuration, when the FPGA’s DONE output goes
High, the HSWAP pin is available as full-featured user-I/O
pin and is powered by the VCCO_0 supply.
DS312-2 (v3.8) August 26, 2009
Product Specification
P
Similarly, the FPGA’s HSWAP pin must be Low to
• Internal memory
• Disk drive
• Over network
• Over RF link
Configuration
Memory
Source
R
Download Host
Intelligent
Microcontroller
Processor
Tester
Computer
SERIAL_OUT
Recommend
open-drain
PROG_B
driver
VCC
GND
PROG_B
V
CLOCK
INIT_B
TMS
TDO
TCK
DONE
TDI
+2.5V
JTAG
Figure 63: Slave Serial Configuration
www.xilinx.com
Slave
Serial
Mode
P
‘1’
‘1’
‘1’
Voltage Compatibility
FPGA’s I/O Bank 2, supplied by the VCCO_2 supply input.
The VCCO_2 voltage can be 3.3V, 2.5V, or 1.8V to match
the requirements of the external host, ideally 2.5V. Using
3.3V or 1.8V requires additional design considerations as
the DONE and PROG_B pins are powered by the FPGA’s
2.5V V
tion of Spartan-3 FPGAs for additional information.
Daisy-Chaining
If the application requires multiple FPGAs with different con-
figurations, then configure the FPGAs using a daisy chain,
as
(M[2:0] = <1:1:1>) for all FPGAs in the daisy-chain. After
the lead FPGA is filled with its configuration data, the lead
FPGA passes configuration data via its DOUT output pin to
the next FPGA on the falling CCLK edge.
V
HSWAP
M2
M1
M0
CCLK
DIN
TDI
PROG_B
TMS
TCK
shown
Most Slave Serial interface signals are within the
CCAUX
Spartan-3E
VCCINT
FPGA
+1.2V
GND
in
supply. See XAPP453: The 3.3V Configura-
Figure
VCCAUX
VCCO_0
VCCO_2
INIT_B
DONE
DOUT
TDO
64.
Use
VCCO_0
+2.5V
V
Functional Description
Slave
V
DS312-2_54_082009
Serial
+2.5V
mode
99

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