BC846BPN,115 NXP Semiconductors, BC846BPN,115 Datasheet - Page 12

• Manufacturer Part Number: BC846BPN,115
• Description: TRANS NPN/PNP 100MA 65V SC88
• Manufacturer: NXP Semiconductors

Specifications of BC846BPN,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Mounting Type: Surface Mount
• Power - Max: 300mW
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 65V
• Transistor Type: NPN, PNP
• Frequency - Transition: 100MHz
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2mA, 5V
• Vce Saturation (max) @ Ib, Ic: 300mV @ 5mA, 100mA / 900mV @ 5mA, 100mA
• Dc Collector/base Gain Hfe Min: 270
• Minimum Operating Temperature: - 55 C
• Configuration: Dual
• Transistor Polarity: NPN/PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 65 V
• Emitter- Base Voltage Vebo: 6 V
• Continuous Collector Current: 100 mA
• Maximum Dc Collector Current: 200 mA
• Power Dissipation: 200 mW
• Maximum Operating Frequency: 100 MHz
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934063471115

NXP Semiconductors
11. Soldering
BC846BPN_1
Product data sheet
Fig 20. Reflow soldering footprint SOT363 (SC-88)
Fig 21. Wave soldering footprint SOT363 (SC-88)
4.5
2.35
1.5
1.3
(4 )
0.6
(4 )
0.5
2.45
Rev. 01 — 17 July 2009
5.3
(4 )
(4 )
0.5
0.6
1.3
2.65
1.8
65 V, 100 mA NPN/PNP general-purpose transistor
(2 )
0.6
1.5
1.5
0.4 (2 )
0.3
2.5
Dimensions in mm
BC846BPN
direction during soldering
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
solder paste
occupied area
preferred transport
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
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