0750180014 Molex Inc, 0750180014 Datasheet
0750180014
Specifications of 0750180014
Related parts for 0750180014
0750180014 Summary of contents
Page 1
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION BOARD TO BOARD CONNECTOR 75005 Receptacle Assembly 1.0 2.0 3.0 4.0 5.0 6.0 REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 HIGH SPEED MEZZANINE 75003 Plug Assembly ...
Page 2
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 1.0 SCOPE This specification covers the mating and unmating process, soldering process, and board layout techniques for the High Speed Mezzanine connector. The interface consists of a differential pair of signal lines over molded in ...
Page 3
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 4.0 INSERTION AND WITHDRAWAL This section describes the preferred methods for inserting and withdrawing the High Speed Mezzanine connectors. It also describes the special zippering feature of this connector which allows for the full rotation ...
Page 4
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 4.2 Maximum Offset in X and Y Direction During Insertion: Centerline Centerline Centerline Centerline Centerline Centerline X-Direction 4.3 Mating Sequence During Insertion: Step 1 Step 1 Step 1 Step 3 Step 3 Step 3 Mating ...
Page 5
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 5.0 Application to PCB This product is designed for Pin thru Paste attachment and recommended for convection or IR reflow processing. Refer to the following sections for information on the proper solder stencil layout, reflow ...
Page 6
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 5.2 Recommended Reflow and Rework Temperatures: Initial Attach: 1) Maximum Reflow Temperature: 240 2) Maximum Reflow Shear Rate: 2 Rework: 1) Rework of the connector requires a full replacement. 2) Rework of the connector requires ...
Page 7
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 5.4 Inspection: NOTE: The Ground Peg has been tested and qualified without protruding below the surface of the PCB. This connector uses a Pin-thru-Paste application and only requires that >50% of the peg is covered ...
Page 8
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 6.0 Mated Stack Height Mated Stack Mated Stack Height Height “M” “M” Mated Stack # of Differential Height (mm) 9.00 9.00 9.00 9.00 10.00 10.00 10.00 10.00 11.00 11.00 11.00 11.00 12.00 12.00 13.00 13.00 ...
Page 9
HIGH SPEED MEZZANINE APPLICATION SPECIFICATION Mated Stack # of Differential Height (mm) *17.00 *17.00 *17.00 *17.00 17.00 17.00 17.00 17.00 17.00 17.00 18.00 18.00 18.00 18.00 19.00 19.00 19.00 19.00 21.00 21.00 21.00 21.00 23.00 23.00 23.00 23.00 25.00 25.00 ...