BFP 540ESD E6327 Infineon Technologies, BFP 540ESD E6327 Datasheet

TRANS RF NPN 4.5V ESD SOT-343

BFP 540ESD E6327

Manufacturer Part Number
BFP 540ESD E6327
Description
TRANS RF NPN 4.5V ESD SOT-343
Manufacturer
Infineon Technologies
Datasheet

Specifications of BFP 540ESD E6327

Package / Case
SC-70-4, SC-82-4, SOT-323-4, SOT-343
Transistor Type
NPN
Voltage - Collector Emitter Breakdown (max)
5V
Frequency - Transition
30GHz
Noise Figure (db Typ @ F)
0.9dB ~ 1.4dB @ 1.8GHz
Gain
21.5dB
Power - Max
250mW
Dc Current Gain (hfe) (min) @ Ic, Vce
50 @ 20mA, 3.5V
Current - Collector (ic) (max)
80mA
Mounting Type
Surface Mount
Dc Collector/base Gain Hfe Min
50 at 20 mA at 3.5 V
Minimum Operating Temperature
- 65 C
Configuration
Single Dual Emitter
Transistor Polarity
NPN
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
4.5 V
Emitter- Base Voltage Vebo
1 V
Maximum Dc Collector Current
0.08 A
Power Dissipation
250 mW
Maximum Operating Frequency
30000 MHz
Maximum Operating Temperature
+ 150 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
BFP 540ESD E6327
BFP540ESDE6327INTR
BFP540ESDE6327XT
SP000105377
NPN Silicon RF Transistor*
• For ESD protected high gain low noise amplifier
• Excellent ESD performance
• Outstanding G
• Gold metallization for high reliability
• SIEGET
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
* Short term description
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type
BFP540ESD
Maximum Ratings
Parameter
Collector-emitter voltage
T
T
Collector-emitter voltage
Collector-base voltage
Emitter-base voltage
Collector current
Base current
Total power dissipation
T
Junction temperature
Ambient temperature
Storage temperature
1
2
Pb-containing package may be available upon special request
T S is measured on the collector lead at the soldering point to the pcb
A
A
S
typical value 1000 V (HBM)
Noise Figure F = 0.9 dB
> 0°C
≤ 0°C
≤ 77°C
45 - Line
ms
= 21.5 dB
Marking
AUs
2)
1=B
1)
2=E
Pin Configuration
3=C
1
Symbol
V
V
V
V
I
I
P
T
T
T
C
B
CEO
CES
CBO
EBO
tot
j
A
stg
4=E
-
4
-65 ... 150
-65 ... 150
-
3
Value
250
150
4.5
10
10
80
4
1
8
Package
SOT343
BFP540ESD
2009-12-04
1
2
Unit
V
mA
mW
°C

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BFP 540ESD E6327 Summary of contents

Page 1

NPN Silicon RF Transistor* • For ESD protected high gain low noise amplifier • Excellent ESD performance typical value 1000 V (HBM) • Outstanding Noise Figure F = 0.9 dB • Gold metallization for high ...

Page 2

Thermal Resistance Parameter 1) Junction - soldering point Electrical Characteristics at T Parameter DC Characteristics Collector-emitter breakdown voltage mA Collector-emitter cutoff current Collector-base ...

Page 3

Electrical Characteristics at T Parameter AC Characteristics (verified by random sampling) Transition frequency mA GHz C CE Collector-base capacitance MHz ...

Page 4

Simulation Data For SPICE-model as well as for S-parameters including noise parameters refer to our internet website: www.infineon.com/rf.models. and download the latest version before actually starting your design. The simulation data have been generated and verified GHz ...

Page 5

Total power dissipation P tot 300 250 200 150 100 100 T [°C] S Permissible Pulse Load ƒ totmax totDC 0.005 0.01 0.02 ...

Page 6

Third order Intercept Point Ω ) (Output parameter 900 MHz [mA ...

Page 7

Power gain parameter in GHz [V] CE Noise ...

Page 8

Source impedance for min. noise figure vs. frequency 1.5 0.5 0.4 0.3 0.2 0.1 1.8GHz 2.4GHz 0.9GHz 0.1 0.2 0.3 0.4 0.5 1 1.5 2 3GHz ...

Page 9

Package Outline +0.1 0.3 -0.05 4x 0.1 M Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT343 0.9 ±0.1 2 ±0.2 0.1 MAX. 1.3 0.1 4 ...

Page 10

... For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. ...

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