ON5520,215 NXP Semiconductors, ON5520,215 Datasheet

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ON5520,215

Manufacturer Part Number
ON5520,215
Description
MOSFET RF SOT23 TO-236AB
Manufacturer
NXP Semiconductors
Datasheet

Specifications of ON5520,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current Rating
-
Power - Output
-
Frequency
-
Gain
-
Transistor Type
-
Noise Figure
-
Current - Test
-
Voltage - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934063418215
1. Product profile
2. Pinning information
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
N-channel enhancement mode Field-Effect Transistor (FET) in a small
SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using
TrenchMOS technology.
This type is a selection of the 2N7002 by the parameter V
Table 1.
I
I
I
I
I
Pin
1
2
3
ON5520
N-channel TrenchMOS FET
Rev. 01 — 24 March 2009
Logic level threshold compatible
Surface-mounted package
Logic level translator
V
R
DS
DSon
60 V
Description
gate (G)
source (S)
drain (D)
Pinning
5
Simplified outline
1
I
I
I
I
I
Very fast switching
TrenchMOS technology
High-speed line driver
I
P
D
3
tot
300 mA
2
0.83 W
GS(th)
.
Graphic symbol
Product data sheet
G
mbb076
D
S

Related parts for ON5520,215

ON5520,215 Summary of contents

Page 1

ON5520 N-channel TrenchMOS FET Rev. 01 — 24 March 2009 1. Product profile 1.1 General description N-channel enhancement mode Field-Effect Transistor (FET small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using TrenchMOS technology. This type is a selection ...

Page 2

... NXP Semiconductors 3. Ordering information Table 2. Type number Package ON5520 4. Marking Table 3. Type number ON5520 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol DGR GSM tot ...

Page 3

... NXP Semiconductors 120 P der (%) 100 P tot P = ------------------------ 100 % der P tot 25 C Fig 1. Normalized total power dissipation as a function of solder point temperature ( single pulse sp DM Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage ON5520_1 Product data sheet 03aa17 ...

Page 4

... NXP Semiconductors 6. Thermal characteristics Table 5. Symbol R th(j-sp) R th(j-a) [1] Mounted on a Printed-Circuit Board (PCB); minimum footprint; vertical in still air th(j-sp) (K/ 0.5 0.2 0.1 10 0.05 0.02 single pulse Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration ON5520_1 Product data sheet ...

Page 5

... NXP Semiconductors 7. Characteristics Table unless otherwise specified. j Symbol Static characteristics V (BR)DSS V GS(th) I DSS I GSS R DSon Dynamic characteristics C iss C oss C rss off Source-drain diode ON5520_1 Product data sheet Characteristics Parameter Conditions drain-source breakdown voltage gate-source threshold I = 0.25 mA; D voltage and 150 C ...

Page 6

... NXP Semiconductors (A) 0.8 0.6 0.4 0 Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values (A) 0.8 0.6 0 150 and 150 Fig 7. Transfer characteristics: drain current as a function of gate-source voltage; typical values ON5520_1 Product data sheet 003aab352 10000 DSon (m ) 8000 4 ...

Page 7

... NXP Semiconductors 3 V max GS(th) (V) typ 2 min 0.25 mA Fig 9. Gate-source threshold voltage as a function of junction temperature (A) 0.8 0.6 0.4 0.2 150 C 0 0.2 0.4 0 and 150 Fig 11. Source current as a function of source-drain voltage; typical values ON5520_1 Product data sheet 003aab101 ...

Page 8

... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 Fig 13. Package outline SOT23 ON5520_1 Product data sheet scale 3.0 1.4 2.5 1.9 0.95 2.8 1 ...

Page 9

... NXP Semiconductors 9. Revision history Table 7. Revision history Document ID Release date ON5520_1 20090324 ON5520_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 24 March 2009 ON5520 N-channel TrenchMOS FET Supersedes - © NXP B.V. 2009. All rights reserved ...

Page 10

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 11

... NXP Semiconductors 12. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Legal information 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 10.2 Defi ...

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