IPP12CNE8N G Infineon Technologies, IPP12CNE8N G Datasheet

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IPP12CNE8N G

Manufacturer Part Number
IPP12CNE8N G
Description
MOSFET N-CH 85V 67A TO-220
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPP12CNE8N G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
12.9 mOhm @ 67A, 10V
Drain To Source Voltage (vdss)
85V
Current - Continuous Drain (id) @ 25° C
67A
Vgs(th) (max) @ Id
4V @ 83µA
Gate Charge (qg) @ Vgs
64nC @ 10V
Input Capacitance (ciss) @ Vds
4340pF @ 40V
Power - Max
125W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.0129 Ohms
Drain-source Breakdown Voltage
85 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
67 A
Power Dissipation
125 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IPP12CNE8NGX
IPP12CNE8NGXK
SP000096467
Rev. 1.05
1)
2)
3)
Features
• N-channel, normal level
• Excellent gate charge x R
• Very low on-resistance R
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC
• Ideal for high-frequency switching and synchronous rectification
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
J-STD20 and JESD22
T
see figure 3
jmax
=150°C and duty cycle D=0.01 for Vgs<-5V
®
2 Power-Transistor
IPB12CNE8N G
PG-TO263-3
12CNE8N
2)
3)
j
=25 °C, unless otherwise specified
DS(on)
DS(on)
1)
product (FOM)
for target application
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
IPD12CNE8N G
PG-TO252-3
12CNE8N
stg
T
T
T
I
I
di /dt =100 A/μs,
T
T
D
D
page 1
C
C
C
j,max
C
=67 A, R
=67 A, V
=25 °C
=100 °C
=25 °C
=25 °C
=175 °C
DS
GS
=68 V,
=25
Product Summary
V
R
I
IPI12CNE8N G
PG-TO262-3
12CNE8N
D
DS
DS(on),max
IPB12CNE8N G
IPI12CNE8N G
(TO252)
-55 ... 175
55/175/56
Value
268
154
±20
125
67
48
6
IPP12CNE8N G
PG-TO220-3
12CNE8N
IPD12CNE8N G
IPP12CNE8N G
12.4
85
67
Unit
A
mJ
kV/μs
V
W
°C
V
m
A
2007-08-29

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IPP12CNE8N G Summary of contents

Page 1

... = /dt di /dt =100 A/μs, T =175 °C j,max =25 °C tot stg page 1 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N G Product Summary (TO252) DS(on),max I D IPI12CNE8N G IPP12CNE8N G PG-TO262-3 PG-TO220-3 12CNE8N 12CNE8N Value 67 48 268 =25 154 = ±20 125 -55 ... 175 55/175/ 12 Unit A mJ kV/μ °C 2007-08-29 ...

Page 2

... V = =125 ° = GSS = = DS(on) (TO252 (TO262 (TO220, TO263 |>2 DS(on)max = (one layer, 70 μm thick) copper area for drain connection. PCB is page 2 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N G Values min. typ. max 1 0 100 - 1 100 - 9.2 12.4 - 9.4 12.6 - 9.7 12 Unit K/W V μ ...

Page 3

... See figure 16 for gate charge parameter definition Rev. 1.05 Symbol Conditions C iss oss f =1 MHz C rss t d(on = =33 d(off = plateau oss =25 ° S,pulse = =25 ° = /dt =100 A/μ page 3 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N G Values min. typ. max. - 3260 4340 = 608 809 - = =1 =100 5 268 - 1 1.2 - 103 , S - 255 Unit 2007-08-29 ...

Page 4

... DS C parameter Rev. 1.05 2 Drain current I =f(T D 100 150 200 T [° Max. transient thermal impedance Z =f(t thJC parameter μs 10 μs 100 μ [V] DS page 4 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N 100 T [° 0.5 0.2 0.1 -1 0.05 0.02 0.01 single pulse - [s] p 150 200 - ...

Page 5

... Typ. transfer characteristics I =f |>2 DS(on)max parameter 250 200 150 100 Rev. 1.05 6 Typ. drain-source on resistance R DS(on) parameter 6 [ Typ. forward transconductance g =f(I fs 175 °C 25 ° [V] GS page 5 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N =f(I =25 ° 5 [ =25 ° 100 [ 2007-08-29 ...

Page 6

... Crss Rev. 1.05 10 Typ. gate threshold voltage V =10 V GS(th) parameter: I typ 60 100 140 180 T [° Forward characteristics of reverse diode I =f(V F parameter [V] DS page 6 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N =f 3.5 830 μ μA 2.5 2 1.5 1 0.5 0 -60 - 100 T [° 175 ° °C, 98% ...

Page 7

... Drain-source breakdown voltage =f BR(DSS 100 -60 -20 20 Rev. 1.05 14 Typ. gate charge V =f(Q GS parameter °C 100 °C 100 1000 t [μ Gate charge waveforms 60 100 140 180 T [°C] j page 7 IPB12CNE8N G IPD12CNE8N G IPI12CNE8N G IPP12CNE8N =67 A pulsed gate [nC] gate s(th g(th ate 2007-08-29 ...

Page 8

... PG-TO220-3: Outline Rev. 1.05 IPB12CNE8N G IPI12CNE8N G page 8 IPD12CNE8N G IPP12CNE8N G 2007-08-29 ...

Page 9

... Rev. 1.05 IPB12CNE8N G IPI12CNE8N G page 9 IPD12CNE8N G IPP12CNE8N G 2007-08-29 ...

Page 10

... PG-TO-263-3 (D²-Pak) Rev. 1.05 IPB12CNE8N G IPI12CNE8N G page 10 IPD12CNE8N G IPP12CNE8N G 2007-08-29 ...

Page 11

... PG-TO252-3: Outline Rev. 1.05 IPB12CNE8N G IPI12CNE8N G page 11 IPD12CNE8N G IPP12CNE8N G 2007-08-29 ...

Page 12

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.05 IPB12CNE8N G IPI12CNE8N G page 12 IPD12CNE8N G IPP12CNE8N G 2007-08-29 ...

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