IRF830 STMicroelectronics, IRF830 Datasheet

MOSFET N-CH 500V 4.5A TO-220

IRF830

Manufacturer Part Number
IRF830
Description
MOSFET N-CH 500V 4.5A TO-220
Manufacturer
STMicroelectronics
Series
PowerMESH™r
Datasheet

Specifications of IRF830

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.5 Ohm @ 2.7A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
4.5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
30nC @ 10V
Input Capacitance (ciss) @ Vds
610pF @ 25V
Power - Max
100W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
497-2732-5

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DESCRIPTION
This power MOSFET is designed using the
company’s consolidated strip layout-based MESH
OVERLAY
and improves the performances compared with
standard parts from various sources.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
First Digit of the Datecode Being Z or K Identifies Silicon Characterized in this Datasheet
August 1998
IRF830
Symbol
dv/dt(
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVER
I
V
DM
V
V
T
P
DGR
I
I
T
GS
stg
DS
D
D
tot
TYPE
( )
j
1
)
Drain-source Voltage (V
Drain- gate Voltage (R
Gate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
®
DS(on)
process. This technology matches
500 V
V
= 1.35
DSS
N - CHANNEL 500V - 1.35
< 1.5
R
DS(on)
c
Parameter
GS
= 25
GS
= 20 k )
= 0)
o
C
c
c
4.5 A
= 25
= 100
I
D
o
C
o
C
(
1
) I
SD
PowerMESH
INTERNAL SCHEMATIC DIAGRAM
4.5A, di/dt
75 A/ s, V
-65 to 150
TO-220
- 4.5A - TO-220
Value
DD
150
500
500
100
4.5
2.9
0.8
3.5
18
20
V
(BR)DSS
1
2
, Tj
MOSFET
3
IRF830
T
JMAX
W/
Unit
V/ns
o
o
W
V
V
V
A
A
A
C
C
o
C
1/8

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IRF830 Summary of contents

Page 1

... Pulse width limited by safe operating area First Digit of the Datecode Being Identifies Silicon Characterized in this Datasheet August 1998 PowerMESH I DS(on) D 4.5 A INTERNAL SCHEMATIC DIAGRAM Parameter = 100 4.5A, di/ IRF830 - 4.5A - TO-220 MOSFET TO-220 Value Unit 500 V 500 4 100 W o 0.8 W/ 3.5 V/ns o -65 to 150 C ...

Page 2

... IRF830 THERMAL DATA R Thermal Resistance Junction-case thj-case Thermal Resistance Junction-ambient Rthj-amb R Thermal Resistance Case-sink thc-sink T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbol I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited Single Pulse Avalanche Energy AS o (starting ELECTRICAL CHARACTERISTICS (T OFF Symbol ...

Page 3

... V = 400 Test Conditions V = 400 4 4 (see test circuit, figure 5) Test Conditions 4.5 A di/dt = 100 100 150 (see test circuit, figure 5) Thermal Impedance IRF830 Min. Typ. Max. Unit 11 7 Min. Typ. Max. Unit Min. Typ. Max. Unit 4 1.6 V 435 ns 3 3/8 ...

Page 4

... IRF830 Output Characteristics Transconductance Gate Charge vs Gate-source Voltage 4/8 Transfer Characteristics Static Drain-source On Resistance Capacitance Variations ...

Page 5

... Normalized Gate Threshold Voltage vs Temperature Source-drain Diode Forward Characteristics Normalized On Resistance vs Temperature IRF830 5/8 ...

Page 6

... IRF830 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 Fig. 1: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 7

... IRF830 inch TYP. MAX. 0.181 0.051 0.107 0.050 0.027 0.034 0.067 0.067 0.203 0.106 0.409 0.645 0.551 0.116 0.620 0.260 0.154 0.151 P011C ...

Page 8

... IRF830 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice ...

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