MTD5P06VT4G ON Semiconductor, MTD5P06VT4G Datasheet

MOSFET P-CH 60V 5A DPAK

MTD5P06VT4G

Manufacturer Part Number
MTD5P06VT4G
Description
MOSFET P-CH 60V 5A DPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of MTD5P06VT4G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
450 mOhm @ 2.5A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
20nC @ 10V
Input Capacitance (ciss) @ Vds
510pF @ 25V
Power - Max
40W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.45 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
3.6 S
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
5 A
Power Dissipation
2100 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MTD5P06VT4GOS
MTD5P06VT4GOS
MTD5P06VT4GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MTD5P06VT4G
Manufacturer:
DIODES
Quantity:
43 000
Part Number:
MTD5P06VT4G
Manufacturer:
ON
Quantity:
12 500
Part Number:
MTD5P06VT4G
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
MTD5P06V
Power MOSFET
5 Amps, 60 Volts P−Channel DPAK
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using the minimum recommended
2. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 6
MAXIMUM RATINGS
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t
Drain Current − Continuous @ 25°C
Total Power Dissipation @ 25°C
Derate above 25°C
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
(V
I
Thermal Resistance
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 seconds
L
This Power MOSFET is designed to withstand high energy in the
Avalanche Energy Specified
I
Pb−Free Packages are Available
pad size.
DD
= 5 Apk, L = 10 mH, R
DSS
Junction−to−Case
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
= 25 Vdc, V
and V
DS(on)
− Continuous @ 100°C
− Single Pulse (t
GS
p
Rating
J
≤ 10 ms)
= 10 Vdc, Peak
= 25°C
Specified at Elevated Temperature
(T
G
GS
C
= 25 W)
A
= 25°C unless otherwise noted)
= 1.0 MW)
Preferred Device
= 25°C (Note 2)
p
≤ 10 ms)
Symbol
T
V
V
V
R
R
R
J
V
E
I
GSM
P
DGR
, T
T
DSS
I
I
DM
qJC
qJA
qJA
GS
D
D
AS
D
L
stg
−55 to
Value
± 15
± 25
0.27
3.75
71.4
175
125
100
260
2.1
60
60
18
40
5
4
1
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
mJ
°C
°C
W
W
†For information on tape and reel specifications,
Preferred devices are recommended choices for future use
and best overall value.
MTD5P06V
MTD5P06VT4
MTD5P06VT4G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1 2
V
(BR)DSS
Device
60 V
3
ORDERING INFORMATION
Y
WW
5P06V = Device Code
G
G
4
http://onsemi.com
CASE 369C
STYLE 2
(Pb−Free)
R
DPAK
Package
= Year
= Work Week
= Pb−Free Package
P−Channel
DS(on)
DPAK
DPAK
DPAK
340 mW
D
Publication Order Number:
TYP
S
Gate
2500/Tape & Reel
2500/Tape & Reel
MARKING
DIAGRAM
1
75 Units/Rail
Drain
Drain
Shipping
MTD5P06V/D
4
2
I
D
5.0 A
3
Source
MAX

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MTD5P06VT4G Summary of contents

Page 1

... T 260 L Device MTD5P06V MTD5P06VT4 MTD5P06VT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. 1 http://onsemi ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−Source Breakdown Voltage ( Vdc 0.25 mAdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc, ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS 10V 25° DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0 ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

TOTAL GATE CHARGE (nC) g Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge DRAIN−TO−SOURCE DIODE ...

Page 6

SINGLE PULSE T = 25° 100 LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward ...

Page 7

... G 0.13 (0.005) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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