IRF6637 International Rectifier, IRF6637 Datasheet - Page 3

• Manufacturer Part Number: IRF6637
• Description: MOSFET N-CH 30V 14A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6637

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 7.7 mOhm @ 14A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 14A
• Vgs(th) (max) @ Id: 2.35V @ 250µA
• Gate Charge (qg) @ Vgs: 17nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 1330pF @ 15V
• Power - Max: 2.3W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric MP
• Configuration: Single Quad Drain Dual Source
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 7.7 m Ohms
• Drain-source Breakdown Voltage: 30 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 14 A
• Power Dissipation: 2.3 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Fall Time: 3.8 ns
• Minimum Operating Temperature: - 40 C
• Rise Time: 15 ns
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ƒ
„
ˆ
ƒ Surface mounted on 1 in. square Cu
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling, mounting pad with large heatsink.
T
@T
@T
@T
C
measured with thermocouple incontact with top (Drain) of part.
A
A
C
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.05
0.02
0.01
0.20
0.10
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fg
f
dg
eg
g
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
‰
small clip heatsink (still air)
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
‰
Š
1
Ci= τi/Ri
back and with small clip heatsink.
0.01
Mounted on minimum footprint full size board with metalized
R
R
θ
1
R
is measured at
1
τ
2
τ
R
2
2
R
2
R
τ
0.1
with
3
3
R
τ
3
3
τ
J
R
4
τ
Typ.
4
R
12.5
4
–––
–––
1.0
20
4
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
τ
5
5
R
τ
-40 to + 150
5
5
1
τ
τ
C
Max.
0.018
τ
footprint full size board with
metalized back and with small
clip heatsink (still air)
270
‰ Mounted on minimum
2.3
1.5
42
Ri (°C/W)
0.6676
1.0462
1.5611
29.282
25.455
Max.
ƒ
–––
–––
–––
10
3.0
55
0.000066
0.000896
0.004386
0.68618
32
τi (sec)
IRF6637
100
Units
Units
°C/W
W/°C
°C
W
3