BUK9604-40A,118 NXP Semiconductors, BUK9604-40A,118 Datasheet - Page 4
![MOSFET N-CH 40V 75A SOT404](/photos/5/31/53144/568-d2pak_sot404_sml.jpg)
BUK9604-40A,118
Manufacturer Part Number
BUK9604-40A,118
Description
MOSFET N-CH 40V 75A SOT404
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet
1.BUK9E04-40A127.pdf
(15 pages)
Specifications of BUK9604-40A,118
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
4 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
75A
Vgs(th) (max) @ Id
2V @ 1mA
Gate Charge (qg) @ Vgs
128nC @ 5V
Input Capacitance (ciss) @ Vds
8260pF @ 25V
Power - Max
300W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.004 Ohms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
198 A
Power Dissipation
300 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934056694118
BUK9604-40A /T3
BUK9604-40A /T3
BUK9604-40A /T3
BUK9604-40A /T3
Philips Semiconductors
7. Thermal characteristics
Table 4:
9397 750 08649
Product data
Symbol
R
R
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
th(j-a)
th(j-mb)
Z th(j-mb)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to mounting
base
(K/W)
10 -1
10 -2
10 -3
1
10 -6
0.1
0.05
0.2
0.02
= 0.5
Single Shot
7.1 Transient thermal impedance
10 -5
10 -4
Rev. 01 — 24 October 2001
Conditions
vertical in still air; SOT78 and
SOT226 packages
mounted on printed circuit board;
minimum footprint; SOT404
package
Figure 4
10 -3
10 -2
BUK95/96/9E04-40A
TrenchMOS™ logic level FET
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
10 -1
P
t p
T
t p (s)
=
Value
60
50
0.5
t p
T
t
1
Unit
K/W
K/W
K/W
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