PHD9NQ20T,118 NXP Semiconductors, PHD9NQ20T,118 Datasheet
PHD9NQ20T,118
Specifications of PHD9NQ20T,118
PHD9NQ20T /T3
PHD9NQ20T /T3
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PHD9NQ20T,118 Summary of contents
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PHD9NQ20T N-channel TrenchMOS standard level FET Rev. 03 — 16 December 2010 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor (FET plastic package using TrenchMOS technology. This product is designed and qualified for ...
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... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 G gate [ drain 3 S source mb D mounting base; connected to drain [ not possible to make connection to pin 2. 3. Ordering information Table 3. Ordering information Type number Package Name PHD9NQ20T DPAK 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134) ...
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... NXP Semiconductors 100 P der (%) 100 Fig 1. Normalized total power dissipation as a function of mounting base temperature ( DS(on D. ° single pulse mb DM Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PHD9NQ20T Product data sheet 003aae674 100 I D (%) ...
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... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from th(j-mb) junction to mounting base R thermal resistance from th(j-a) junction to ambient Fig 5. Transient thermal impedance from junction to mounting base as a function of pulse duration PHD9NQ20T Product data sheet Conditions mounted on printed-circuit board ; ...
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... NXP Semiconductors 6. Characteristics Table 6. Characteristics Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold GS(th) voltage I drain leakage current DSS I gate leakage current GSS R drain-source on-state DSon resistance Dynamic characteristics Q total gate charge G(tot) Q gate-source charge GS Q gate-drain charge GD C input capacitance ...
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... NXP Semiconductors ( ( 0.4 0 °C j Fig 6. Output characteristics: drain current as a function of drain-source voltage; typical values ( > DSon Fig 8. Transfer characteristics: drain current as a function of gate-source voltage; typical values 2.9 a 2.1 1.3 0.5 −60 20 Fig 10. Normalized drain-source on-state resistance factor as a function of junction temperature ...
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... NXP Semiconductors − (A) −2 10 −3 10 minimum −4 10 −5 10 − ° Fig 12. Sub-threshold drain current as a function of gate-source voltage ( ° Fig 14. Gate-source voltage as a function of gate charge; typical values PHD9NQ20T Product data sheet 003aae684 typical maximum (V) GS Fig 13. Input, output and reverse transfer capacitances ...
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... NXP Semiconductors 7. Package outline Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped DIMENSIONS (mm are the original dimensions) UNIT 2.38 0.93 0.89 1.1 mm 2.22 0.46 0.71 0.9 OUTLINE VERSION IEC SOT428 Fig 16. Package outline SOT428 (DPAK) PHD9NQ20T Product data sheet mounting ...
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... Data sheet status Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number PHD9NQ20T separated from data sheet PHB_PHD_PHP9NQ20T v.2. ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .4 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9 9 Legal information .10 9.1 Data sheet status ...