DP-DSG2 METCAL, DP-DSG2 Datasheet - Page 3
![no-image](/images/no-image-200.jpg)
DP-DSG2
Manufacturer Part Number
DP-DSG2
Description
Desoldering Tool Assembly
Manufacturer
METCAL
Datasheet
1.DP-DSG2.pdf
(28 pages)
Specifications of DP-DSG2
Accessory Type
Desolder Tool Assembly
Peak Reflow Compatible (260 C)
No
Leaded Process Compatible
No
For Use With
OK Internationals Metcal SP440-21 Desoldering Station
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Staying ahead of developments in SMT
Metcal changed rework with the introduction of SmartHeat systems,
which minimize process variability and set new standards for
design and ease-of-use. For years, Metcal users have been realizing
significant increases in throughput and reduced scrap rates.
Convection rework
But with today’s large, high pin-count, fine-pitch components
and multilayer boards, convection systems have become
increasingly necessary. Convection systems heat all leads
simultaneously, ensuring even reflow. Gentle temperature rise
rates protect boards and components. There is no direct
mechanical contact on the leads, so the risk of pad damage is
minimal and components can be easily salvaged for reuse. Because
a wide variety of components can be accomodated by a simple
nozzle change, convection systems are potentially very flexible.
However, in practice, convection systems have been much more
difficult to optimize. Operators had to develop skill in balancing
temperature and air flow, aiming the air stream, and shielding
components. And thus the benefits of convection rework have
only been realized through a considerable amount of operator
training, limiting their use.
A new approach to convection
Now Metcal changes rework again by introducing the QX2. We
combined OK International’s experience in convection processes
with the Metcal legacy of safer, faster, and easier operation.
From the moment you take it out of the box, you know the QX2
is like no other convection system. Set-up is fast and easy,
requiring no special tools, fixturing, or testing.
Unlike conventional convection systems, the Metcal QX2
provides simplified controls and automation, reducing operator
training requirements. The system controller is moveable to
suit your preferences and simplifies operation with its push-
button configuration.
The need for shielding is minimized through the use of focused
convection nozzles, which direct heat exactly where it is
needed. Nozzles can be changed in seconds with a simple
quick-release system.
An easy-to-use underboard preheater is available to evenly heat
boards and prevent warping during the rework of large compo-
nents and multilayered boards.
To maintain greater process control, the heater exhaust temper-
ature is held constant. The temperature setpoint is low to min-
imize thermal stress. Should it be necessary to change the set-
point to accomodate process changes, such as new soldering
alloys, the QX2 incorporates a lockout code allowing authorized
personnel to reprogram it.
To vary heating all that is required is that the airflow level be
adjusted. This makes optimizing heat delivery very simple.
During the removal cycle, the vacuum pick-up automatically
lifts the component from the board when the solder reflows, and
then shuts off the heat. The time used in the removal cycle is
stored and displayed as a guide for establishing the minimum
time to reattach a similar component.
Never before has convection rework been so safe, fast, and easy.
introducing the QX2
1