DP-DSG2 METCAL, DP-DSG2 Datasheet - Page 26

• Manufacturer Part Number: DP-DSG2
• Description: Desoldering Tool Assembly
• Manufacturer: METCAL

Specifications of DP-DSG2

• Accessory Type: Desolder Tool Assembly
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• For Use With: OK Internationals Metcal SP440-21 Desoldering Station
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

flexible systems for tomorrow’s electronics
What if you need the ultimate in process control and flexibil-
ity for advances packages like BGA, µBGA, and FlipChip?
There are new chips being developed every day. And some of
those chips are going to land on your assembly line tomorrow.
How can you be sure that the system you buy today will do the
job three years from now?
During the early 1990's, we recognized the shift towards array
packaging and the implications this had on rework, specifically
the need for accurate profiling and greater levels of process
control. Rather than simply modify a QFP rework system, the
first BGA Micro Oven products were designed specifically to
meet the requirements of array package technology. At OK
we also understand that to most customers, rework is a
non-value-added operation. With this in mind, the products
were developed to be cost-effective and easy to use, offering
the user great flexibility to deal with the ever expanding range
of components available.
In addition, we have long-established relationships with
technology leaders in the computer, telecommunications and
components industries. Our global network works alongside
the development teams creating new component types.
This allows us to be ready with systems to deal with new
component types as they reach the market.
As the recognized leader in BGA, CSP, and leading-edge
technology rework, we've been invited to speak at over one
hundred conferences worldwide. We conduct non-commercial
seminars and workshops worldwide on these fast-changing topics.
These multi-media presentations include a non-commercial
overview of technology, applications, and methodology,
followed by a hands-on workshop to reinforce principles and
techniques from the seminar.
What does all this mean for you?
It means we know what chips are coming out before
you’ve seen them. So we can better prepare you with a
system that will not only meet today’s needs today, but
tomorrow’s needs as well.
Call your local OK International Distributor or Representative
for more information, or visit
www.okinternational.com