NTMD4820NR2G ON Semiconductor, NTMD4820NR2G Datasheet

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NTMD4820NR2G

Manufacturer Part Number
NTMD4820NR2G
Description
MOSFET N-CH DUAL 30V 8A 8-SOIC
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTMD4820NR2G

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
20 mOhm @ 7.5A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
4.9A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
7.7nC @ 4.5V
Input Capacitance (ciss) @ Vds
940pF @ 15V
Power - Max
750mW
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTMD4820NR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
NTMD4820NR2G
Quantity:
4 700
Company:
Part Number:
NTMD4820NR2G
Quantity:
170
Company:
Part Number:
NTMD4820NR2G
Quantity:
170
Company:
Part Number:
NTMD4820NR2G
Quantity:
10
NTMD4820N
Power MOSFET
30 V, 8 A, Dual N−Channel, SOIC−8
Features
Applications
1. Surface−mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 2
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
Power Dissipation
R
Continuous Drain
Current R
Power Dissipation
R
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy T
I
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t ≤ 10 s (Note 1)
Junction−to−FOOT (Drain)
Junction−to−Ambient – Steady State (Note 2)
L
Low R
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
Dual SOIC−8 Surface Mount Package Saves Board Space
Disk Drives
DC−DC Converters
Printers
qJA
qJA
qJA
= 11 A
(Note 1)
(Note 2)
t < 10 s (Note 1)
pk
J
DS(on)
qJA
qJA
qJA
, L = 1.0 mH, R
= 25C, V
(Note 1)
(Note 2)
t < 10 s
to Minimize Conduction Losses
Rating
Rating
DD
= 30 V, V
(T
G
Steady
State
J
= 25 W
= 25°C unless otherwise stated)
T
t
A
p
GS
= 10 ms
= 25°C,
T
T
T
= 10 V,
T
T
T
T
T
T
A
A
A
A
A
A
A
A
A
= 25°C
= 25°C
= 25°C
= 25°C
= 70°C
= 25°C
= 70°C
= 25°C
= 70°C
T
Symbol
Symbol
J
V
R
R
R
EAS
R
V
, T
I
P
P
P
DSS
DM
T
I
I
I
I
qJA
qJA
qJF
qJA
GS
D
D
D
S
D
D
D
L
STG
−55 to
Value
167.5
+150
1.28
0.75
60.5
Max
97.5
±20
260
6.4
5.1
4.9
3.9
8.0
6.4
2.0
2.0
30
32
62
40
1
°C/W
Unit
Unit
mJ
°C
°C
W
W
W
V
V
A
A
A
A
A
†For information on tape and reel specifications,
NTMD4820NR2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
8
Device
(BR)DSS
30 V
1
ORDERING INFORMATION
4820N = Device Code
A
Y
WW
G
http://onsemi.com
G
CASE 751
STYLE 11
27 mW @ 4.5 V
20 mW @ 10 V
SOIC−8
R
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Pb−Free)
N−Channel
Package
SOIC−8
DS(on)
Publication Order Number:
MARKING DIAGRAM
& PIN ASSIGNMENT
Max
D
S
8
1
2500/Tape & Reel
D1 D1 D2 D2
S1 G1 S2 G2
NTMD4820N/D
AYWW
Shipping
4820N
G
I
D
8 A
Max

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NTMD4820NR2G Summary of contents

Page 1

... J STG +150 I 2 EAS 60 260 °C L Device NTMD4820NR2G Symbol Max Unit R 97.5 †For information on tape and reel specifications, qJA including part orientation and tape sizes, please R 62 qJA refer to our Tape and Reel Packaging Specification °C/W Brochure, BRD8011/ qJF R 167 ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Tem- perature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coeffi- cient Drain−to−Source On Resistance Forward Transconductance CHARGES, ...

Page 3

T = 25° 12 4 3.8 V 7 0.5 1.0 1.5 2.0 2 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics ...

Page 4

C iss 1000 900 800 700 600 500 C oss 400 300 200 C 100 rss DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 7. Capacitance Variation 1000 ...

Page 5

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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