TT8M2TR Rohm Semiconductor, TT8M2TR Datasheet

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TT8M2TR

Manufacturer Part Number
TT8M2TR
Description
MOSFET N/P-CH 30V 2.5A TSST8
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of TT8M2TR

Fet Type
N and P-Channel
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
90 mOhm @ 2.5A, 4.5V
Drain To Source Voltage (vdss)
30V, 20V
Current - Continuous Drain (id) @ 25° C
2.5A
Vgs(th) (max) @ Id
1.5V @ 1mA
Gate Charge (qg) @ Vgs
3.2nC @ 4.5V
Input Capacitance (ciss) @ Vds
180pF @ 10V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
8-TSST
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TT8M2TR
Quantity:
9 000
2.5V Drive Nch MOSFET
1.5V Drive Pch MOSFET
Silicon N-channel MOSFET/
Silicon P-channel MOSFET
1) Low on-state resistance.
2) Low voltage drive.
3) High power package.
Switching
<Tr1 : Nch>
∗ 1 Pw ≤ 10µs, Duty cycle ≤ 1%
Drain−source voltage
Gate−source voltage
Drain current
Source current
(Body diode)
c
www.rohm.com
Type
TT8M2
Structure
Features
Application
Packaging specifications
Absolute maximum ratings (Ta=25°C)
TT8M2
2009 ROHM Co., Ltd. All rights reserved.
Parameter
Package
Code
Basic ordering unit (pieces)
Continuous
Pulsed
Continuous
Pulsed
Taping
3000
TR
Symbol
V
V
I
I
DSS
GSS
I
I
DP
SP
D
S
∗ 1
∗ 1
Limits
±2.5
±12
±10
0.8
30
10
1/8
Dimensions (Unit : mm)
Inner circuit
Unit
∗1 ESD protection diode
∗2 Body diode
∗2
V
V
A
A
A
A
TSST8
(8)
(1)
Abbreviated symbol : M02
∗1
(8)
(1)
(7)
(2)
(7)
(2)
∗2
(6)
(3)
Each lead has same dimensions
(5)
(4)
(6)
(3)
∗1
(5)
(4)
2009.06 - Rev.A
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Source
(4) Tr2 Gate
(5) Tr2 Drain
(6) Tr2 Drain
(7) Tr1 Drain
(8) Tr1 Drain

Related parts for TT8M2TR

TT8M2TR Summary of contents

Page 1

Drive Nch MOSFET 1.5V Drive Pch MOSFET TT8M2 Structure Silicon N-channel MOSFET/ Silicon P-channel MOSFET Features 1) Low on-state resistance. 2) Low voltage drive. 3) High power package. Application Switching Packaging specifications Package Taping Type Code TR Basic ordering ...

Page 2

TT8M2 <Tr2 : Pch> Parameter Drain−source voltage Gate−source voltage Continuous Drain current Pulsed Continuous Source current (Body diode) Pulsed ∗ ≤ 10µs, Duty cycle ≤ 1% <Tr1 AND Tr2> Parameter Total power dissipation Channel temperature Range of Storage ...

Page 3

TT8M2 Electrical characteristics (Ta=25°C) < Characteristics for the Tr2( Pch ).> Parameter Symbol Min. Gate-source leakage I GSS −20 Drain-source breakdown voltage V (BR) DSS Zero gate voltage drain current I DSS −0.3 Gate threshold voltage V GS (th) Static ...

Page 4

TT8M2 Electrical characteristics curves <Nch> 2.5 Ta=25°C Pulsed V = 10V 4. =4. 2. ...

Page 5

TT8M2 10 V =0V GS Pulsed 1 Ta=125°C 0.1 Ta=75°C Ta=25°C Ta=-25°C 0.01 0 0.5 1 1.5 SOURCE-DRAIN VOLTAGE : V [V] SD Fig.10 Reverse Drain Current vs. Sourse-Drain Voltage 1000 Ta=25°C R =10Ω 15V Pulsed ...

Page 6

TT8M2 <Pch> -4. -2. -1. -1. Ta=25°C Pulsed -1. -1. 0.2 0.4 0.6 0.8 1 DRAIN-SOURCE ...

Page 7

TT8M2 300 Ta=25°C Pulsed 250 I = -2.5A D 200 150 100 -1. GATE-SOURCE VOLTAGE : -V [V] GS Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage 10000 Ciss ...

Page 8

TT8M2 Measurement circuits < Nch > D.U. Fig.1-1 Switching Time Measurement Circuit D.U.T. I G(Const Fig.2-1 ...

Page 9

No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose ...

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