SIDC16D60SIC3 Infineon Technologies, SIDC16D60SIC3 Datasheet
SIDC16D60SIC3
Specifications of SIDC16D60SIC3
Related parts for SIDC16D60SIC3
SIDC16D60SIC3 Summary of contents
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... Die Size 1.26 x 1.26 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC16D60SIC3 A C Package Ordering Code Q67050-A4271- sawn on foil A101 1.26 x 1.26 0.960 x 0.960 1 ...
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... Chip should not be used without being embedded in pottant with breakdown field strength lower than 9 KV/mm at full blocking voltage. Dynamic Electrical Characteristics Parameter Symbol Total capacitive charge Q C Switching time Total capacitance C Edited by INFINEON Technologies HV3, Edition 1, 22.01.2004 SIDC16D60SIC3 Symbol Condition RSM = =10 ms sinusoidal ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, Edition 1, 22.01.2004 SIDC16D60SIC3 960 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, Edition 1, 22.01.2004 SIDC16D60SIC3 INFINEON TECHNOLOGIES SDT05S60 ...