STPS1L30U STMicroelectronics, STPS1L30U Datasheet - Page 4

• Manufacturer Part Number: STPS1L30U
• Description: DIODE SCHOTTKY 30V 1A SMB
• Manufacturer: STMicroelectronics

Specifications of STPS1L30U

• Voltage - Forward (vf) (max) @ If: 395mV @ 1A
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 200µA @ 30V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AA, SMB
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 1 A
• Max Surge Current: 75 A
• Configuration: Single
• Forward Voltage Drop: 0.395 V
• Maximum Reverse Leakage Current: 200 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2468-2

STPS1L30
Figure 11: Forward voltage drop versus
forward current (typical values, high level)
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
4/7
10.00
140
120
100
80
60
40
20
1.00
0.10
0
0
R
0.0
I
th(j-a)
FM
(A)
(°C/W)
0.1
1
T =150°C
j
0.2
T =100°C
j
S(Cu)(cm²)
2
0.3
V
FM
0.4
(V)
3
T =25°C
j
0.5
4
0.6
0.7
5
Figure 12: Forward voltage drop versus
forward current (maximum values, low level)
Figure 14: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)
120
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
80
60
40
20
0
0.10
0.0
I
R
FM
th(j-a)
(A)
0.15
0.5
(°C/W)
(typical values)
T =150°C
0.20
j
1.0
0.25
1.5
T =125°C
j
0.30
S(Cu)(cm²)
2.0
0.35
2.5
V
FM
0.40
3.0
(V)
T =25°C
0.45
j
3.5
T =100°C
j
0.50
4.0
0.55
4.5
0.60
5.0