HN2D02FUTW1T1G ON Semiconductor, HN2D02FUTW1T1G Datasheet - Page 3

DIODE SWITCH 80V 100MA SC88

HN2D02FUTW1T1G

Manufacturer Part Number
HN2D02FUTW1T1G
Description
DIODE SWITCH 80V 100MA SC88
Manufacturer
ON Semiconductor
Datasheets

Specifications of HN2D02FUTW1T1G

Voltage - Forward (vf) (max) @ If
1.2V @ 100mA
Current - Reverse Leakage @ Vr
100nA @ 75V
Current - Average Rectified (io) (per Diode)
100mA (DC)
Voltage - Dc Reverse (vr) (max)
80V
Reverse Recovery Time (trr)
3ns
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
3 Independent
Mounting Type
Surface Mount
Package / Case
SC-70-6, SC-88, SOT-363
Product
Ultra Fast Recovery Rectifier
Configuration
Triple Parallel
Reverse Voltage
80 V
Forward Voltage Drop
1.2 V
Recovery Time
3 ns
Forward Continuous Current
0.1 A
Max Surge Current
1 A
Reverse Current Ir
0.1 uA
Power Dissipation
0.3 W
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
HN2D02FUTW1T1GOSTR

Available stocks

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Manufacturer
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Price
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Manufacturer:
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Quantity:
2 000
Part Number:
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Manufacturer:
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Quantity:
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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H
E
A1
6
1
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
5
2
e
4
3
A
−E−
*For additional information on our Pb−Free strategy and soldering
b
0.0157
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
6 PL
0.2 (0.008)
M
0.0197
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
0.50
A3
E
M
http://onsemi.com
SC−88 (SOT−363)
CASE 419B−02
L
ISSUE W
0.0748
3
1.9
C
SCALE 20:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
Y14.5M, 1982.
STYLE 1:
DIM
H
A1
A3
A
C
D
PIN 1. EMITTER 2
b
E
e
L
E
inches
mm
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
MIN
0.80
0.00
0.10
0.10
1.80
1.15
0.10
2.00
0.025
0.025
0.65
0.65
MILLIMETERS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.65 BSC
0.20 REF
NOM
0.95
0.05
0.21
0.14
2.00
1.25
0.20
2.10
MAX
1.10
0.10
0.30
0.25
2.20
1.35
0.30
2.20
0.031
0.000
0.004
0.004
0.070
0.045
0.004
0.078
HN2D02FUTW1T1/D
MIN
0.026 BSC
0.008 REF
INCHES
0.037
0.002
0.008
0.005
0.078
0.049
0.008
0.082
NOM
0.043
0.004
0.012
0.010
0.086
0.053
0.012
0.086
MAX

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