BAT54XY,115 NXP Semiconductors, BAT54XY,115 Datasheet
BAT54XY,115
Specifications of BAT54XY,115
934059127115
BAT54XY T/R
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BAT54XY,115 Summary of contents
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BAT54XY Schottky barrier quadruple diode in very small SOT363 package Rev. 02 — 13 January 2010 1. Product profile 1.1 General description Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two electrically isolated dual Schottky barrier ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BAT54XY 4. Marking Table 4. Type number BAT54XY [ made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode FRM ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-s) [1] Soldering point at pins and 6. 7. Characteristics Table amb Symbol Per diode [1] Pulse test: t BAT54XY_2 Product data sheet Schottky barrier quadruple diode in very small SOT363 package Thermal characteristics Parameter thermal resistance from junction to soldering point Characteristics ° ...
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... NXP Semiconductors (mA (1) (2) (3) 1 − 0.4 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values BAT54XY_2 Product data sheet ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 4. Package outline SOT363 (SC-88) BAT54XY_2 Product data sheet Schottky barrier quadruple diode in very small SOT363 package ...
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... NXP Semiconductors 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAT54XY SOT363 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BAT54XY_2 Product data sheet ...
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... Revision history Document ID Release date BAT54XY_2 20100113 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Table 2 • Figure 4 “Package outline SOT363 BAT54XY_1 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Legal information ...