NE5520379A NEC, NE5520379A Datasheet - Page 9

• Manufacturer Part Number: NE5520379A
• Description: RF GaAs L&S Band LD-MOSFET
• Manufacturer: NEC

Specifications of NE5520379A

• Mounting Style: SMD/SMT
• Forward Transconductance Gfs (max / Min): 2.5 S
• Gate-source Breakdown Voltage: 5 V
• Continuous Drain Current: 1.5 A
• Power Dissipation: 20 W
• Package / Case: 79A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per pin of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10122EJ03V0DS
Soldering Conditions
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
NE5520379A
HS350-P3
WS260
VP215
For soldering
IR260
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