CY7C1470BV33-167AXC Cypress Semiconductor Corp, CY7C1470BV33-167AXC Datasheet - Page 24

CY7C1470BV33-167AXC

CY7C1470BV33-167AXC

Manufacturer Part Number
CY7C1470BV33-167AXC
Description
CY7C1470BV33-167AXC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1470BV33-167AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1470BV33-167AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1470BV33-167AXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
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Part Number:
CY7C1470BV33-167AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Switching Characteristics
Over the Operating Range. Timing reference is 1.5V when V
(a) of
Notes
Document #: 001-15031 Rev. *G
16. This part has an internal voltage regulator; t
17. t
18. At any voltage and temperature, t
19. This parameter is sampled and not 100% tested.
t
Clock
t
F
t
t
Output Times
t
t
t
t
t
t
t
Setup Times
t
t
t
t
t
t
Hold Times
t
t
t
t
t
t
Power
CYC
CH
CL
CO
OEV
DOH
CHZ
CLZ
EOHZ
EOLZ
AS
DS
CENS
WES
ALS
CES
AH
DH
CENH
WEH
ALH
CEH
MAX
from steady-state voltage.
bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to
achieve High Z before Low Z under the same system conditions.
CHZ
Parameter
“AC Test Loads and Waveforms” on page 23
[16]
, t
CLZ
, t
EOLZ
, and t
V
Clock Cycle Time
Maximum Operating Frequency
Clock HIGH
Clock LOW
Data Output Valid After CLK Rise
OE LOW to Output Valid
Data Output Hold After CLK Rise
Clock to High Z
Clock to Low Z
OE HIGH to Output High Z
OE LOW to Output Low Z
Address Setup Before CLK Rise
Data Input Setup Before CLK Rise
CEN Setup Before CLK Rise
WE, BW
ADV/LD Setup Before CLK Rise
Chip Select Setup
Address Hold After CLK Rise
Data Input Hold After CLK Rise
CEN Hold After CLK Rise
WE, BW
ADV/LD Hold after CLK Rise
Chip Select Hold After CLK Rise
EOHZ
CC
are specified with AC test conditions shown in (b) of
(typical) to the First Access Read or Write
x
x
EOHZ
Setup Before CLK Rise
Hold After CLK Rise
is less than t
[17, 18, 19]
[17, 18, 19]
power
Description
is the time power is supplied above V
EOLZ
[17, 18, 19]
[17, 18, 19]
and t
unless otherwise noted.
CHZ
is less than t
DDQ
CLZ
= 3.3V and is 1.25V when V
“AC Test Loads and Waveforms” on page
to eliminate bus contention between SRAMs when sharing the same data
DD
Min
1.4
4.0
2.0
2.0
1.3
1.3
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
1
0
minimum initially, before a read or write operation can be initiated.
–250
CY7C1472BV33, CY7C1474BV33
Max
250
3.0
3.0
3.0
3.0
Min
5.0
2.0
2.0
1.3
1.3
1.4
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
1
0
–200
DDQ
23. Transition is measured ±200 mV
Max
= 2.5V. Test conditions shown in
200
3.0
3.0
3.0
3.0
CY7C1470BV33
Min
6.0
2.2
2.2
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
0.5
0.5
1
0
–167
Max
Page 24 of 31
167
3.4
3.4
3.4
3.4
MHz
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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