CY7C1460AV25-167BZXI Cypress Semiconductor Corp, CY7C1460AV25-167BZXI Datasheet - Page 20
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CY7C1460AV25-167BZXI
Manufacturer Part Number
CY7C1460AV25-167BZXI
Description
CY7C1460AV25-167BZXI
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1460AV25-167BZC.pdf
(29 pages)
Specifications of CY7C1460AV25-167BZXI
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
36M (1M x 36)
Speed
167MHz
Interface
Parallel
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1460AV25-167BZXI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Capacitance
Thermal Resistance
AC Test Loads and Waveforms
Note
Document Number: 38-05354 Rev. *G
C
C
C
20. Tested initially and after any design or process change that may affect these parameters.
Parameters
Parameter
IN
CLK
I/O
JA
JC
OUTPUT
OUTPUT
3.3 V I/O Test Load
2.5 V I/O Test Load
Input capacitance
Clock input capacitance
Input/output capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
[20]
= 50
= 50
Description
Description
(a)
(a)
V
V
T
T
= 1.25 V
[20]
= 1.5 V
R
R
L
L
= 50
= 50
OUTPUT
OUTPUT
3.3 V
2.5 V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
INCLUDING
INCLUDING
JIG AND
JIG AND
V
SCOPE
SCOPE
DD
T
A
Test Conditions
Test Conditions
= 2.5 V V
= 25 °C, f = 1 MHz,
5 pF
5 pF
(b)
(b)
DDQ
R = 317
R = 1667
= 2.5 V
R = 351
R = 1538
100 TQFP
100 TQFP
Package
V
25.21
Max
GND
GND
2.58
V
DDQ
6.5
5.5
3
DDQ
1 ns
1 ns
10%
10%
165 FBGA
165 FBGA
Package
ALL INPUT PULSES
ALL INPUT PULSES
20.8
Max
3.2
7
7
6
90%
90%
(c)
(c)
209 FBGA
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
Package
209 FBGA
25.31
4.48
Max
5
5
7
90%
90%
10%
10%
Page 20 of 29
°C/W
°C/W
1 ns
1 ns
Unit
Unit
pF
pF
pF
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